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Abnormal temperature test data determination method and apparatus, and electronic device

A technology of abnormal temperature and test data, applied in measuring devices, application of thermometers, thermometers, etc., can solve the problem of inaccurate analysis results, and achieve the effect of accurate life failure rate analysis

Pending Publication Date: 2022-03-11
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of this application is to provide a method, device and electronic equipment for determining abnormal temperature test data to solve the problem of inaccurate failure rate analysis results

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  • Abnormal temperature test data determination method and apparatus, and electronic device
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  • Abnormal temperature test data determination method and apparatus, and electronic device

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Embodiment Construction

[0050] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with specific implementations and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary only, and are not intended to limit the scope of the application. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present application.

[0051] A schematic diagram of a layer structure according to an embodiment of the present application is shown in the accompanying drawings. The figures are not drawn to scale, with certain details exaggerated and possibly omitted for clarity. The shapes of the various regions and layers shown in the figure, as well as their relative sizes and positional relationships are only exemplary, and may deviate due to manuf...

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Abstract

The invention discloses a method and device for determining abnormal temperature test data and electronic equipment, and belongs to the technical field of semiconductor production detection, and the method for determining the abnormal temperature test data comprises the steps: obtaining clamp temperature data in a wafer continuous test process; calculating clamp temperature change values of two adjacent tests according to the clamp temperature data; and determining abnormal temperature test data based on the temperature change value. According to the method, the abnormal clamp temperature test data can be accurately determined, so that the test items with abnormal temperature can be eliminated, and the service life failure rate analysis of the wafer is more accurate.

Description

technical field [0001] The application belongs to the technical field of semiconductor production detection, and specifically relates to a method, device and electronic equipment for determining abnormal temperature test data. Background technique [0002] At present, in the field of wafer testing, a test system integrating automatic test equipment, fully automatic probe stations and probe cards is usually used to perform front-end tests on wafers. In the front-end test of the wafer, it is usually necessary to apply a high voltage to the particles (DIE) on the wafer for a period of time to do early life failure rate analysis (ELFR). [0003] With the improvement of product performance, the test environment for product life failure rate analysis will become more stringent. The existing life failure rate analysis has large errors and cannot meet product production needs. Contents of the invention [0004] The purpose of this application is to provide a method, device and el...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K13/00G01R31/26
CPCG01K13/00G01R31/2644G01R31/2601
Inventor 余键
Owner CHANGXIN MEMORY TECH INC