Cooling device of semiconductor process chamber and semiconductor process chamber

Abstract

The invention provides a cooling device of a semiconductor process chamber and the semiconductor process chamber, the cooling device is used for cooling the top wall of a cavity, a fixed plate is connected with the cavity and is arranged opposite to the top wall of the cavity to form an accommodating space for installing cooling pipelines, and the cooling device is provided with a plurality of through holes connected with air inlets of the plurality of cooling pipelines in a one-to-one correspondence manner; the top wall of the cavity of the blocking assembly is divided into a middle cooling area and an edge cooling area, the containing space is divided into a middle cooling space and an edge cooling space, and the multiple cooling pipelines are arranged in the edge cooling space at intervals; one end of the cooling pipeline is connected with the fixing plate and provided with a main pipeline extending in the radial direction of the top wall of the cavity, and the pipe wall of the main pipeline is provided with an air outlet which faces the top wall of the cavity and is spaced from the top wall of the cavity. According to the cooling device of the semiconductor process chamber and the semiconductor process chamber provided by the invention, the cooling effect of the semiconductor process chamber can be improved, so that the influence on heat source reflection of the semiconductor process chamber is reduced, and the service life of the semiconductor process chamber is prolonged.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a cooling device for a process chamber and the process chamber. Background technique [0002] In the chemical vapor deposition (Chemical Vapor Deposition, referred to as CVD) process, the temperature in the process chamber can reach about 1100 ° C. Therefore, the process chamber needs to use quartz material to provide the required temperature environment for the process, and the transparent quartz The outer surface of the outer surface is gold-plated to reflect the heat source into the process chamber with the help of the gold-plated layer, increase the reflectivity of the heat source, and ensure that the temperature in the process chamber can be maintained within the temperature range required by the process, while the metal frame and transmission structure outside the process chamber It is difficult for fixed structures to withstand such high temperatures, there...

AI Technical Summary

Problems solved by technology

However, this will cause the cold air to flow relatively from both sides to the middle, and because the distance of flow is longer and the area is larger, when the cold air flows to the middle of the process chamber, the temperature of the cold air has increased and the wind speed has decreased, resulting in The cooling effect of the cold wind in the middle of the process chamber is weakened, causing the external cooling of the process chamber to be uneven, and, because the edge of the cofferdam 7 has a corner, the cold wind is in the corner area (such as Figure 8 Shown in the middle area P) the wind speed is low and difficult to flow, causing the cooling effect of the cold wind to the corner area is poor, and, because the cold wind is in the arc top area of ​​the cofferdam 7 (such as Figure 8 The wind speed shown in middle area Q) is low, and the cold wind is blocked by the arc cofferdam 7, the wind direction will change when the cold wind reaches the arc top area, resulting in the cold wind may not reach the arc top area of ​​the cofferdam 7, resulting in the cofferdam 7 The corner area and arc top area form a "dead zone" with poor cooling effect

In practical application, because the external cooling of the process chamber is not uniform, the gold-plated layer of the process chamber will be cracked or even peeled off, and because the cooling effect of the corner area and arc top area of ​​the cofferdam 7 is poor, the cofferdam 7 The gold-plated layer in the corner area and arc-top area of ​​the center will fall off more easily, and because the cooling effect in the middle of the process chamber is poor, the gold-plated layer in the middle of the process chamber will fall off first, affecting the heat source reflection effect and service life of the process chamber

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