High-pickup-rate flexible chip mounting mechanism for adsorbing thin and brittle chips

Abstract

The invention discloses a high-pickup-rate flexible chip mounting mechanism for adsorbing a thin and brittle chip, which can increase the force of a suction nozzle for pressing down the chip so as to improve the pickup rate, and can overcome the defect that the thin and brittle chip is easy to crush. A three-axis motion mechanical arm is designed, a high-pickup-rate flexible chip mounting head structure capable of rotating by 360 degrees is installed on a vertical plate base in the up-down Z-axis direction, a visual positioning system is arranged, a chip picked up by the flexible chip mounting head is photographed, a chip mounting head core shaft driving motor is controlled to rotate through comparison, and the chip mounting head core shaft driving motor is controlled to rotate. Adjusting the direction of the chip on the suction nozzle to an ideal position; through driving of the chip mounting head mandrel driving motor, undamped rotation of the chip mounting head mandrel in the air bearing is realized, accurate rotation of the suction nozzle is realized, and through vertical movement of the chip mounting head mandrel in the air bearing and elastic deformation of the annular elastic sheet group at the top end of the chip mounting head mandrel in the vertical direction, counter-acting force of a chip to the suction nozzle is absorbed. The contact force between the suction nozzle and the chip is controlled, and the pickup rate of the chip is improved.

Description

Technical field [0001] The present invention relates to an integrated circuit package placement machine, and particularly relates to a mechanism for a flexible patch placement machine chip suction type crackers high pick rate. Background technique [0002] The integrated circuit package SMD process, the movement of the robot arm under the XYZ axis is provided with a chip mounter and chip area material region, the pre-roll motion of the robot arm front end of the nozzle from the chip or blue film cartridge when the chip is picked up, the pick-up, the XY-axis robot arm to move to the designated position, a Z-axis downward movement driven by the suction nozzle, the suction nozzle and the chip in the cartridge near the chip, a Z-axis robot arm deceleration moving slowly, when the suction nozzle when the front end surface in contact with the chip, the negative pressure solenoid valve open hollow nozzle, a hollow nozzle becomes a negative pressure state, the front end of the chip sucti...

AI Technical Summary

Problems solved by technology

[0002] In the process flow of integrated circuit packaging and placement, there are chip material area and placement area under the XYZ three-axis motion robot arm of the placement machine. When picking up the chip, the XY axis of the robotic arm moves to the specified position first, and the Z axis drives the suction nozzle to move downward. When the suction nozzle is close to the chip in the chip magazine, the Z axis of the robotic arm slows down and moves slowly. When the front end is in contact with the upper surface of the chip, open the hollow negative pressure solenoid valve of the suction nozzle, and the hollow suction nozzle becomes a negative pressure state, and the chip is adsorbed to the front end of the suction nozzle, lifted on the Z axis, and the pickup is completed; when placing the chip, move the mechanical arm XY The axis drives the suction nozzle and the chip material to move to the designated position together, and the Z axis drives the suction nozzle to start moving downward. When the chip is close to the substrate, the Z axis of the mechanical arm decelerates and moves slowly. When the lower surface of the chip contacts the upper surface of the substrate, the suction is turned off. Hollow nozzle negative pressure solenoid valve, open the suction nozzle hollow positive pressure solenoid valve, the suction nozzle is hollow and becomes positive pressure state, the chip is separated from the suction nozzle, lifted on the Z axis, and the attachment is completed; when the chip used in production is a thin and brittle chip When picking up and placing chips, the difficulty of picking up and placing chips is greater than that of ordinary silicon-based chips. The contact force between the suction nozzle and the chip should not be too large, otherwise the chip will be damaged; the existing equipment mostly uses the elastic Z-axis method to solve the problem of contact force when picking up and placing the chip. Control problem, but this control structure has a complex mechanism, and the computer software programming control can only be applied to a specific chip of a specification. When the chip picked up changes, it needs to be reprogrammed. It cannot adapt to multiple materials and cannot automatically switch suction. Nozzles can only have one elastic coefficient, and the range of process adaptation is very limited; how to solve the problem of chip pressure control through simple mechanical deformation of the nozzle, improve the high linearity of flexible deformation, and be suitable for a variety of chip materials, has become Problems to be solved on site

[0003] The chips in the picked-up magazine are generally rectangular or square pieces, which are light, thin, and brittle. They are grasped on the suction nozzle by negative pressure, and separated from the suction nozzle by positive air pressure. With static electricity, the self-weight of the chip alone cannot separate from the suction nozzle, and requires positive pressure to separate from the suction nozzle; the chips arranged in a straight line in the material box have different angles between the chips, and some chips even have 180° errors Reverse placement problem. After the chip is picked up by the suction nozzle, the orientation of the chip needs to be adjusted. The rotation adjustment angle of the existing placement head is limited, generally within 30°. When the chip placement angle error exceeds 30°, only Error reminders can be used to correct deviations through manual intervention

[0004] The placement machine is generally equipped with an XYZ three-axis motion robot arm to complete the displacement in the three directions of left and right, front and rear, and up and down, so as to complete the picking and transfer of materials, especially the link of picking chips from the material box. Accurate positioning of the picked-up chip is related to the quality of the subsequent placement. How to adjust and position the suction nozzle of the picked-up chip at a large angle is related to the speed and efficiency of the production rhythm of the process; especially for thin and brittle When picking up chips, when the pressure of the suction nozzle is light, the pick-up rate will be reduced, and when the pressure of the suction nozzle is high, the chip pick-up rate will be increased, but there are thin and brittle chips that are easy to be crushed, how to use simple and reliable The unique flexible adsorption method solves the contradictory relationship between the strength of the suction nozzle pressing down on the chip and the pick-up rate, which is a problem that needs to be solved on site

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