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Composite body, molded body, and method for producing molded body

A manufacturing method and composite technology, applied in the field of composites, can solve problems such as energy consumption and insufficient mechanical strength of thin sheets

Active Publication Date: 2022-03-15
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since a large amount of water is used in the manufacture of paper using this paper strengthening agent, a large amount of energy is consumed in drying compared to dry papermaking.
[0006] Moreover, in the technology described in Patent Document 1, even if the paper strength enhancer described in Patent Document 2 is used instead of polyester fiber resin, due to dry method to manufacture thin sheets, and thus the mechanical strength of the thin sheets may be insufficient

Method used

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  • Composite body, molded body, and method for producing molded body
  • Composite body, molded body, and method for producing molded body
  • Composite body, molded body, and method for producing molded body

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Embodiment Construction

[0016] Hereinafter, several embodiments of the present invention will be described. The embodiments described below are for describing an example of the present invention. The present invention is not limited to the inventions of the following embodiments, and includes various modifications implemented within a range that does not change the gist of the present invention. In addition, not all the structures described below are essential structures of the present invention.

[0017] 1. Complex

[0018] The complex according to this embodiment includes fiber and dextrin. figure 1 It is a schematic diagram enlargedly showing the complex according to this embodiment.

[0019] The composite C100 according to this embodiment includes fiber C1 and dextrin C2, and at least a part of dextrin C2 adheres to fiber C1. Moreover, it has the following characteristics, that is, dextrin C2 has a first maximum value and a second maximum value in the molecular weight distribution curve, and ...

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Abstract

The invention provides a composite body, a molded body and a method for manufacturing the molded body, the composite body has good biodegradability, and the mechanical strength of the molded body such as paper formed by the composite body is good. The composite includes fibers and dextrin, at least a portion of the dextrin adheres to the fibers, the molecular weight distribution curve of the dextrin has a first maximum value and a second maximum value, and the value of the weight-average molecular weight obtained on the basis of the peak to which the first maximum value belongs is less than 6,000, and the value of the weight-average molecular weight obtained on the basis of the peak to which the second maximum value belongs is less than 6,000. The value of the weight-average molecular weight obtained on the basis of the peak value to which the second maximum value belongs is 6000 or more.

Description

technical field [0001] The present invention relates to a composite body, a molded body and a method for producing the molded body. Background technique [0002] As a method for producing molded articles such as paper, a method called a dry method that does not use water at all or almost is expected. For example, Patent Document 1 discloses a technique of manufacturing a sheet by mixing fibers and a thermoplastic resin by a dry method and applying heat while the mixture is deposited. [0003] In addition, Patent Document 2 discloses a paper strength enhancer capable of using starch with a low degree of polymerization and reducing the energy consumption in the drying process. [0004] However, the sheet manufacturing method disclosed in Patent Document 1 uses thermoplastic polyester fiber resin or the like for bonding fibers together. Since such resins are synthesized from petroleum in many cases, a large amount of CO is involved in the resin manufacturing process. 2 relea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N1/02B27N3/00B27N3/04B27N3/08B27N3/18C08B30/18D04H1/587
CPCB27N1/0209B27N3/002B27N3/04B27N3/08B27N3/18C08B30/18D04H1/587D21H17/24B27N9/00B27N3/007C08L3/02C09D103/02D21H17/28D21H19/54
Inventor 横川忍田中英树中井葉子樋口尚孝
Owner SEIKO EPSON CORP