Method for producing contact probe for probe head of electronic device, and corresponding contact probe
A manufacturing method and technology of electronic devices, which are applied to parts, manufacturing tools, and additive manufacturing of electrical measuring instruments, and can solve problems such as inability to obtain reproducibility.
Pending Publication Date: 2022-03-22
TECHNOPROBE
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Problems solved by technology
[0023] However, there is no known method that allows to obtain the best dimensional accuracy on probes manufactured in the same batch, nor perfect reproducibility, which needs to take into account the statistical calculation of the maximum tolerance for each batch
[0024] Furthermore, none of the known methods allows the fabrication of probes comprising more or less complex shapes of material alternation
[0025] The technical problem of the present invention is to provide a manufacturing method for the manufacture of contact probes for integrated device probe heads, which is capable of manufacturing any complex geometry using any combination of materials while ensuring the high precision of the obtained probes probes, thereby overcoming the limitations and disadvantages that still plague methods implemented according to the prior art
Method used
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[0050] With reference to the accompanying drawings, and in particular to the image 3 , describes a manufacturing method for manufacturing contact probes for probe heads realized by a 3D printing device, the 3D printing device is indicated by 20 as a whole, and the corresponding contact probes obtained thereby are indicated by 10 .
[0051] It should be noted that the figures are schematic and not drawn to scale, but rather are designed in such a way as to emphasize important features of the invention.
[0052] Furthermore, the process steps described below do not form a complete process flow for manufacturing contact probes. The present invention can be implemented with known 3D printing techniques, including only those common process steps necessary to understand the present invention.
[0053] Finally, it is important to note that measures related to vertical or buckling beam probes can also be transferred to other types of probes, such as cantilever probes, microprobes, et...
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Abstract
A manufacturing method for manufacturing at least one contact probe (10) for an electronic device testing apparatus probe head comprises the step of submicron 3D printing of the contact probe (10) using at least one printing material selected from a conductor material or a semiconductor material.
Description
technical field [0001] The invention relates in its more general aspect to a production method for the production of contact probes for probe heads of electronic devices and corresponding contact probes, the following description will be made with reference to this field of application, the sole purpose of which is to simplify its description. Background technique [0002] As we all know, a probe head is essentially a device suitable for electrically connecting a microstructure, especially a plurality of contact pads of an electronic device integrated on a wafer, with the corresponding channels of a test test or general test. [0003] Testing of integrated devices is used to detect and isolate defective devices already in production. Typically, the probe tips are then used to electrically test the devices integrated on the wafer before they are diced and mounted into chip packaging packages. [0004] Probe heads generally comprise a large number of contact elements or cont...
Claims
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IPC IPC(8): G01R1/073G01R31/28
CPCG01R1/07371G01R31/2886G01R3/00G01R1/06755Y02P10/25G01R1/06733B33Y10/00B33Y80/00B22F10/22B28B1/001G01R1/067
Inventor 罗伯特·克里帕
Owner TECHNOPROBE