A packaging structure for power management chips

Abstract

The present invention relates to the technical field of chip packaging, in particular to a packaging structure for power management chips, including a circuit board, on which a chip packaging body is mounted, and a protection component for protecting the chip packaging body is mounted on the circuit board, The protection component is provided with a dust removal component for cleaning the dust at the connection between the chip package body and the circuit board, and the protection component is provided with a heat dissipation component for dissipating heat from the chip package body. The purpose of the present invention is to provide a power management chip oriented The package structure can protect the chip package body and avoid damage to the chip package body due to collision and extrusion with other devices. At the same time, it can clean the dust at the connection between the chip package body and the circuit board to avoid dust from affecting the chip package body. In addition, it can Heat dissipation is performed on the chip package body to avoid the impact of excessive temperature on the chip package body.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a packaging structure for power management chips. Background technique [0002] With the advancement of science and technology, smart electronic products have gradually entered people's lives, especially in power management, which can improve people's comfort in life. Chips used in power management are the decisive factor in determining performance. Chips are produced after completion Finally, the chip needs to be packaged and installed on the circuit board. The current chip is packaged with plastic material, which is easy to collide with other devices during use, causing damage to the package. In addition, when the packaged chip is installed on the circuit board, the chip and The connection of the circuit board often accumulates dust. If it is not cleaned in time, the dust will cause poor contact between the chip and the circuit board, and at the same time cause trouble f...

AI Technical Summary

Problems solved by technology

[0002] With the advancement of science and technology, smart electronic products have gradually entered people's lives, especially in power management, which can improve people's comfort in life. Chips used in power management are the decisive factor in determining performance. Chips are produced after completion Finally, the chip needs to be packaged and installed on the circuit board. The current chip is packaged with plastic material, which is easy to collide with other devices during use, causing damage to the package. In addition, when the packaged chip is installed on the circuit board, the chip and The connection of the circuit board often accumulates dust. If it is not cleaned in time, the dust will cause poor contact between the chip and the circuit board, and at the same time cause trouble for maintenance and disassembly; the current chip package has a very poor heat dissipation effect during use, although some circuit boards A cooling fan will be installed on the board, but the cooling fan occupies a large area on the circuit board

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