Electroplating device and electroplating method for electroplating equal-thickness copper layer on printed circuit board
A technology for printed circuit boards and electroplating devices, which is applied in the direction of electrolysis process, electrolysis components, etc., can solve the problems of increasing the work intensity of workers, increasing the production process, and low electroplating precision, so as to improve electroplating efficiency, improve electroplating precision, and compact structure Effect
Active Publication Date: 2022-04-01
四川深北电路科技有限公司
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Problems solved by technology
However, although the electroplating device or electroplating production line in the existing workshop can realize the electroplating operation, there are still the following technical defects: 1. It is necessary to manually pre-wrap a layer of dry film on the outside of the printed circuit board, which undoubtedly increases production. process, while increasing the work intensity of workers
2. After the follow-up quality inspection workers measured, it was found that the thickness of the electroplated copper layer 19 on one side was inconsistent, that is, the thickness of the electroplated copper layer in some areas obviously exceeded the specified range, so such products could not meet the needs of high-end customers at all. There are technical defects of low plating precision
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[0035] The present invention will be further described below in conjunction with accompanying drawing, protection scope of the present invention is not limited to the following:
[0036] Such as Figure 3~4 As shown, an electroplating device for electroplating copper layers of equal thickness on a printed circuit board, it includes a left limit mechanism 2 and a right limit mechanism 3 arranged on the table of a workbench 1 and opposite to each other. The mechanism 2 and the right limit mechanism 3 are symmetrically arranged on the left and right. The bottom surface of the workbench 1 is fixed with a plurality of support legs supported on the ground. There are two ladder positioning columns 4 on the top of the workbench 1. There are also front and rear stoppers 5 and rear stoppers 6 oppositely arranged on the table of the workbench 1. The front stopper 5 and the rear stopper 6 are symmetrical Setting, the front stopper mechanism 5 is arranged on the front side of the two step...
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The invention discloses an electroplating device and an electroplating method for electroplating a copper layer with the same thickness on a printed circuit board, the electroplating device comprises a left limiting mechanism (2) and a right limiting mechanism (3) which are arranged on the table top of a workbench (1) and are oppositely arranged left and right, and two stepped positioning columns (4) fixedly arranged on the table top of the workbench (1) are arranged between the two limiting mechanisms; a front material blocking mechanism (5) and a rear material blocking mechanism (6) which are oppositely arranged front and back are further arranged on the table top of the working table (1), the rear material blocking mechanism (6) is arranged on the rear sides of the two stepped positioning columns (4), and the left limiting mechanism (2) comprises a rack (7) fixedly arranged on the working table (1) and a limiting air cylinder (8) fixedly arranged on the rack (7). The electroplating device has the beneficial effects that the electroplating precision is improved, the electroplating efficiency is improved, and the thickness of the electroplating copper layer can be changed to electroplate the equal-thickness copper layer on the printed circuit board.
Description
technical field [0001] The invention relates to the technical field of production and manufacture of electronic component assemblies, in particular to an electroplating device and an electroplating method for electroplating a copper layer of equal thickness on a printed circuit board. Background technique [0002] Electronic component components include single-sided circuit boards, double-sided circuit boards, PCB boards, multi-layer printed circuit boards, printed circuit boards, etc. These electronic component components are the core components of the controller, which can play an important role, namely It can control the automatic operation of CNC machine tools, cutting equipment, etc. Among them, the electroplating of printed circuit boards is the most common electronic component assembly. In terms of technology, it is required to electroplate a layer of electroplated copper layer 19 on the left and right end faces of the printed circuit board 18. After electroplating, t...
Claims
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IPC IPC(8): C25D7/00C25D3/38C25D17/06
CPCY02P10/20
Inventor 张兴国
Owner 四川深北电路科技有限公司