A handling device, wafer processing equipment, and wafer concentricity adjustment method

Abstract

The invention relates to the technical field of semiconductor manufacturing, and relates to a handling device, wafer processing equipment and a wafer concentricity adjustment method. The handling device includes a handling component, multiple sets of energy detection components and multiple sets of centering adjustment components. The handling component can transport the ring-cut wafer from the upstream station to the disbonding workbench. The upper part is arranged at intervals in a circle with the disbonding workbench as the center of the circle. The circle surrounded by multiple sets of energy detection components is the same size as the circumference of the circular cutting line of the wafer. The energy detection components are used to detect the UV energy irradiated by the UV lamp. The centering adjustment components of the group are arranged at intervals around the wafer on the handling component. The centering adjustment components can push the wafer to move relative to the disbonding workbench, so that each energy detection component can detect UV energy and ensure that the wafer is in good contact with the wafer. Degumming workbench concentric. The wafer processing equipment and the wafer concentricity adjustment method apply the above-mentioned handling device to ensure the concentricity of the wafer and the debonding workbench.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular, to a conveying device, wafer processing equipment and a wafer concentricity adjustment method. Background technique [0002] In semiconductor manufacturing, wafers often need to be thinned to improve device performance. After the wafer is thinned, the support ring on the edge of the wafer needs to be cut and removed. The wafer thinning process includes the Taiko thinning process. The Taiko thinning process is to thin the middle area of ​​the wafer. The edge area of ​​the wafer is not thinned but acts as a support ring. After thinning, the support ring needs to be cut on the wafer, so that a circular dicing line is formed between the support ring and the wafer. Since the UV film is attached to the back of the wafer, the support ring will still adhere to the ring after being cut. On the UV film, it is necessary to use the handling device on the wafer ...

AI Technical Summary

Problems solved by technology

During the wafer handling process of the existing handling device, due to machine assembly errors or wear errors after long-term work, when the handling device places the ring-cut wafers on the debonding workbench, it is difficult to ensure that the wafers are completely bonded to the debonding workbench. The workbench is concentric, so that the UV film attached to the part of the circular cutting line and the support ring is blocked by the degumming workbench, and cannot receive the irradiation of the UV lamp, and the degumming cannot be realized, which reduces the degumming effect on the support ring and affects the follow-up Separate the support ring on the UV film, and it is easy to damage the support ring during the process of separating the support ring

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