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Novel equipment platform for manufacturing semiconductor device and working method thereof

A technology of equipment platform and working method, which is applied in the direction of semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., can solve problems such as the inability to meet the output capacity of wafer processing, and achieve the effect of improving output capacity

Pending Publication Date: 2022-04-05
上海谙邦半导体设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional sense, the cluster structure of a single transfer chamber for multiple wafer processing chambers has been unable to meet the output capability of the equipment platform for wafer processing of short-term process

Method used

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  • Novel equipment platform for manufacturing semiconductor device and working method thereof

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Embodiment Construction

[0023] An embodiment of the present invention provides a novel equipment platform for semiconductor device manufacturing, refer to figure 1 , including: a group of transfer chambers, the group of transfer chambers includes a plurality of transfer chambers; a group of buffer chambers and a group of process chambers arranged around the sides of the group of transfer chambers, and the group of process chambers includes A plurality of process chambers are arranged on a part of the side of the group, the buffer chamber group includes a plurality of buffer chambers, and the buffer chambers are respectively located at the sides of the transfer chamber group. The equipment platform further includes: an equipment front-end module 10, the equipment front-end module 10 is located on the side of the buffer chamber group facing away from the transfer chamber group.

[0024] The transfer chamber group includes the first transfer chamber to the Nth transfer chamber, N is an integer greater t...

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Abstract

The invention relates to a novel equipment platform for manufacturing a semiconductor device and a working method thereof, and the equipment platform comprises a transmission cavity group which comprises a plurality of transmission cavities; the buffer cavity group and the process cavity group are arranged around the periphery of the side part of the conveying cavity group, the process cavity group comprises a plurality of process cavities which are arranged around part of the side part of the conveying cavity group, the buffer cavity group comprises a plurality of buffer cavities, and the buffer cavities are respectively positioned at the side part of the conveying cavity group. The output capability of the equipment platform is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a novel equipment platform for semiconductor device manufacturing and a working method thereof. Background technique [0002] In a typical plasma etching process, different process gases are combined in a radio frequency (Radio frequency) environment to form plasma through radio frequency excitation. The formed plasma undergoes physical bombardment and chemical reaction with the wafer surface under the action of the electric field of the upper and lower electrodes of the etching chamber, and completes the process of designing patterns and key processes on the wafer surface. Typical etching chambers include capacitively coupled chambers (CCP) and inductively coupled chambers (ICP). [0003] The traditional cluster equipment platform for semiconductor device manufacturing includes: an equipment front-end module (including an atmospheric transfer robot) for wafer transfer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67
Inventor 张朋兵陈世名
Owner 上海谙邦半导体设备有限公司