Nano-particle resuspension liquid cooling device and cooling method

Abstract

The invention discloses a nano-particle resuspension liquid cooling device and a cooling method.The liquid cooling device comprises a heat dissipation shell and an electrode arranged in the heat dissipation shell in a penetrating mode, and an inner cavity of the heat dissipation shell is filled with nano-suspension liquid; and the liquid level of the nano suspension liquid in the heat dissipation shell is higher than or lower than the horizontal plane of the electrode. After the lower surface of the heat dissipation shell obtains heat, the heat is conducted to an inner cavity of the heat dissipation shell to be subjected to heat exchange with the nanometer suspension liquid, and the nanometer suspension liquid stored in the heat dissipation shell gradually rises due to heating vaporization. High voltage is loaded on the electrode, so that electric fields are respectively formed between the electrode and the upper cooling clamping plate and between the electrode and the lower cooling clamping plate, potential differences are generated between the electrode and the upper cooling clamping plate and between the electrode and the lower cooling clamping plate, and nano particles in the nano suspension are accelerated to suspend and rise again under the action of the electric fields; heat of nano particles in the nano suspension liquid is conducted to the upper cooling clamping plate for heat exchange, and therefore the purposes of heat dissipation and cooling are achieved.

Description

technical field [0001] The invention belongs to the field of cooling of electronic components, in particular to the technical field of heat pipe cooling, in particular to a nanoparticle resuspension liquid cooling device and a cooling method. Background technique [0002] In the era of rapid information development, with the increasing integration of transistors, the requirements for processor power density and computing speed are getting higher and higher, which makes the processor power consumption larger and requires higher cooling requirements. In response to the continuous increase in power density and the need for stable and reliable operation, many mainstream server manufacturers have begun to launch plate-type liquid cooling products. However, the existing cold plate design is aimed at a specific processor layout, which leads to its limitations, and most of these cooling devices adopt the air-cooled heat dissipation mode, which has a poor cooling effect, and the effe...

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Problems solved by technology

For this reason, it is considered that the effective solution to the heat dissipation problem of current electronic devices is the heat pipe conduction heat dissipation element. With its advantages of high thermal conductivity, reliable operation, simple structure, and uniform temperature, it has been widely used in industry, aviation, national defense, and medical treatment. However, during the heat dissipation process of the heat pipe, it is easy to generate a large amount of heat accumulation inside it, so that the nanofluid working fluid inside the heat pipe will be dried out or the supply will be insufficient, which will cause a sharp rise in temperature, thereby affecting the performance of electronic devices.

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