Cleaning machine for silicon wafer manufacturing

Abstract

The invention relates to the technical field of silicon material processing, and discloses a silicon wafer manufacturing cleaning machine which comprises a machine body, a material frame is placed in the machine body, a circular groove is formed in the top end of the interior of the material frame, the material frame is movably connected with a swing column through the circular groove, and the top end of the swing column is fixedly connected with the bottom end of a swing part. A groove is formed in the middle of the top end of the swing part, the swing part is fixedly connected with the anti-abrasion pad in a sleeving mode through the groove, fixing parts are fixedly connected to the four corners of the top end of the swing part, and a silicon wafer is placed at the top end of the anti-abrasion pad located among the four fixing parts. The swing part and the fixing part are arranged at the top end of the material frame, so that the silicon wafers are placed on the swing part in a vertical or inclined mode, the placement mode of the silicon wafers in the material frame is changed, the situation that the contact area between the silicon wafers and a solution or pure water is small due to stacking of the multiple silicon wafers is avoided, and the cleaning efficiency of the silicon wafers is effectively improved; and the cleaning effect of the silicon wafer is enhanced.

Description

technical field [0001] The invention relates to the technical field of silicon material processing, in particular to a cleaning machine for manufacturing silicon wafers. Background technique [0002] Integrated circuit chips made of silicon wafers are conventional semiconductor products, and cleaning is one of the processes in the production of silicon wafers. Whether the cleaning is clean or not has a great impact on the performance of silicon wafers. The main purpose of silicon wafer cleaning In order to clean the gravel and residual cutting abrasives produced during the cutting process, so that the surface of the silicon wafer can achieve technical indicators such as no corrosion, no oxidation, and no residue, the specific cleaning method of the existing silicon wafer cleaning machine is: place the silicon wafer In the material frame carrying the silicon wafer, soak the material frame into the liquid medicine tank, then lift the material frame, drain the water, and then p...

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the use of the existing silicon wafer cleaning machine proposed in the background technology, the present invention provides a silicon wafer manufacturing cleaning machine, which has an optimized silicon wafer placement method and effectively improves the cleaning efficiency of the silicon wafer surface. The advantage of enhancing the stability of the silicon wafer during the loading and unloading process of the material frame solves the technical problems raised in the above-mentioned background technology

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