Wafer implicit cutting device
A wafer and hidden cutting technology, applied in the field of wafer hidden cutting devices, can solve problems affecting product processing quality, etc., and achieve the effects of improving precision, increasing precision and reducing deformation.
Pending Publication Date: 2022-04-12
河南通用智能装备有限公司
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Problems solved by technology
For thinner silicon wafer products, such an error level affects the processing quality of the product
Method used
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[0017] In the present invention, unless otherwise clearly specified and limited, the technical terms used in the present application shall have the usual meanings understood by those skilled in the present invention. The terms "connected", "connected", "fixed" and "installed" should be understood in a broad sense, which can be fixed connection, detachable connection, or integrated; it can be directly connected or indirectly connected through an intermediary; it can be A mechanical connection may also be an electrical connection. Unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may mean that the first and second features are in direct contact, or indirect contact through an intermediary. Moreover, the first feature being "on" or "above" or "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or it just means that the first feature is higher in level than the seco...
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A wafer hidden cutting device comprises a workbench, the workbench is provided with two parallel supporting guide rails and a cross beam which is driven by a first driving mechanism to be arranged on the two supporting guide rails in a sliding mode, and the cross beam is provided with a longitudinal moving table which is driven by a second driving mechanism and can slide in the length direction of the cross beam. The two ends of the cross beam extend out of the sliding supporting structure, and the middle part of the cross beam warps upwards under the condition that the two ends are stressed, so that the amplitude of downward flexural deformation of the middle part is reduced, and the flexural deformation of the middle part of the cross beam is reduced to a very small extent. Therefore, the precision of the movement process of parts arranged in the middle of the cross beam is improved, and the wafer cutting precision is further improved. The movable cross beam in the wafer implicit cutting device adopts the structure, and the wafer carrier on the cross beam can keep higher levelness in the moving process, so that the precision of the wafer cutting process is improved. And in cooperation with an air floatation movement mechanism, the deformation is further reduced, and the precision is improved.
Description
technical field [0001] The invention belongs to the field of wafer processing, and in particular relates to a wafer implicit cutting device. Background technique [0002] Wafer cutting is the process of cutting inside the wafer with a laser. Wafer dicing requires a high-precision positioning platform. The precision positioning platform is one of the key components in precision mechanical equipment. It provides an object-carrying platform capable of precise positioning and precise movement for the fields of microlithography, numerical control machining, biotechnology, and nanometer surface topography measurement. The linear drive air flotation platform is a mechatronic system, a comprehensive technology integrating linear drive technology, numerical control technology, dynamic and static characteristic analysis and optimization, automatic control principle, testing and experimental analysis, etc. In the field of semiconductor wafer cutting, with the continuous improvement o...
Claims
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IPC IPC(8): B23K26/08B23K26/38
Inventor 陶为银
Owner 河南通用智能装备有限公司