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Component assembling method and electronic device

An assembly method and technology of electronic devices, applied in the direction of electrical components, measuring devices, optical components, etc., to achieve the effect of easy realization, simple process and guaranteed stability

Pending Publication Date: 2022-04-12
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, whether it is to realize the physical connection of the above-mentioned structural glue or the electrical connection of the metal wire, it is necessary that the movable parts of the MEMS actuator and the other components are in a stable position during the assembly process. The movable parts of the device are contradictory in their own movable nature

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  • Component assembling method and electronic device
  • Component assembling method and electronic device
  • Component assembling method and electronic device

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Embodiment Construction

[0035] The technical solutions proposed by the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention. The meaning of "and / or" in this article is to choose one or both.

[0036] Please refer to figure 1 , an embodiment of the present invention provides a component assembly method, comprising the following steps:

[0037] S1, providing a first element, the first element has a fixed part and a movable part, a gap is provided in the fixed part, at least part of the movable part protrudes into the gap, and is opposed to all the parts in the gap said fixed part is movable in at least one...

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Abstract

The invention provides an element assembling method and an electronic device, and the method comprises the steps: at least injecting a fluid into a partial region of a gap, enabling the fluid to become a solid, temporarily fixing a movable part with a fixed part through the solid, guaranteeing that the movable part does not move in the process of assembling a second element to the movable part, and enabling the second element to be assembled on the fixed part. Therefore, the assembling stability of the second element is ensured. And after the second element is assembled, the solid is changed into liquid or gas, so that the solid is removed and the temporary fixation is released, and the movable part can move relative to the fixed part again, so that the temporary fixation is released.

Description

technical field [0001] The invention relates to the technical field of module assembly of electronic products, in particular to a component assembly method and an electronic device. Background technique [0002] With the development of microelectromechanical system (MicroElectroMechanical System, MEMS) technology, and electronic products, smart devices, etc. are increasingly moving towards miniaturization and high performance, other components are assembled on the movable parts of MEMS actuators , and then realize the movement of other components, which has become one of the realization means of module assembly of some electronic products. This component assembly method usually needs to realize the physical connection of the structural adhesive between the movable part of the MEMS actuator and the other components, and the electrical connection of the metal bonding wire between the other components and the MEMS actuator . [0003] However, whether it is to realize the phys...

Claims

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Application Information

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IPC IPC(8): B81B7/02B81B7/00B81C1/00G02B7/02G02B7/00G03B30/00H04N5/225
Inventor 桂珞韩凤芹
Owner NINGBO SEMICON INT CORP