Photoetching processing system and method
A lithography processing and to-be-processed technology, which is applied in microlithography exposure equipment, photolithographic process exposure devices, etc., can solve the problems of low processing efficiency, difficulty in realizing micro-nano structure preparation, etc., and achieve the effect of improving processing efficiency.
Pending Publication Date: 2022-04-12
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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Problems solved by technology
However, the above-mentioned preparation methods have low processing efficiency and are difficult to realize the preparation of large-area micro-nano structures.
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[0027] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application.
[0028] In the description of the present application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present application and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operat...
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The invention discloses a photoetching processing system and method. The photoetching processing system comprises a light source module, an energy adjusting module, a light beam modulation module, a light beam shaping module, a focusing module and a displacement module. The energy adjusting module is coupled with the light source module; the light beam modulation module is coupled with the energy adjustment module; the beam shaping module is coupled with the beam modulation module; the focusing module is in coupling connection with the beam shaping module, and the focusing module comprises a plano-convex cylindrical lens; the displacement module is used for driving the to-be-processed sample to move. Through the treatment of the beam shaping module and the focusing module, the linear light source with uniform energy distribution and larger area can be obtained, so that the sample to be processed can be uniformly ablated, and the processing efficiency can be improved; and meanwhile, the displacement module is used for driving the to-be-processed sample to move so as to process the next area, so that the preparation of the large-area micro-nano structure can be realized.
Description
technical field [0001] The present application relates to the application field of laser processing, in particular to a photolithographic processing system and method. Background technique [0002] In recent years, with the rapid development of micro-nano structure preparation technology, the preparation of nano-gratings with high precision and high diffraction limit has attracted extensive attention. At present, the commonly used methods for preparing micro-nano structures are electron beam lithography, focused ion beam lithography, laser interference lithography, and laser-induced periodic surface structure. However, the above-mentioned preparation methods have low processing efficiency and are difficult to realize the preparation of large-area micro-nano structures. Contents of the invention [0003] This application aims to solve at least one of the technical problems existing in the prior art. For this reason, the present application proposes a photolithography proc...
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Inventor 徐少林乔靖宇黄佳旭徐康黄凌羽
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA