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Planarization device and planarization method

A planarization method and planarization technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as improving the efficiency of planarization processing, and achieve the effect of improving efficiency and accuracy

Pending Publication Date: 2022-04-12
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Abstract
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Problems solved by technology

[0003] However, with the currently designed planarization device that supports particle beam polishing technology, it is difficult to improve the accuracy of the planarization process while improving the efficiency of the planarization process during the process of planarizing the wafer.

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  • Planarization device and planarization method
  • Planarization device and planarization method
  • Planarization device and planarization method

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Embodiment Construction

[0025] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present disclosure.

[0026] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. The figures are not drawn to scale, with certain details exaggerated and possibly omitted for clarity of presentation. The shapes of the various regions and layers shown in the figure, as well as their relative sizes and positional relationships are only exemplary, and may deviate due to manufacturing tolerances or technical limitations in practice, and those skilled in the art will Regions / layers with different shapes, s...

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Abstract

The invention discloses a planarization device and a planarization method, relates to the technical field of semiconductors, and is used for improving the planarization processing efficiency and improving the planarization processing precision at the same time. The flattening device comprises a clamping part, a particle beam generator and a shielding part. The clamping part is used for clamping a wafer. The particle beam generator is arranged on one side of the clamping part and is used for generating a particle beam for flattening the wafer, and the axial direction of the particle beam is parallel to the upper surface of the pre-reserved part of the wafer. The shielding part is arranged between the particle beam generator and the pre-reserved part of the wafer, and the shielding part is used for at least shielding the particle beam emitted to the pre-reserved part of the wafer. The planarization device is used for carrying out planarization processing on a wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a planarization device and a planarization method. Background technique [0002] Particle beam polishing technology is an emerging planarization technology. Compared with chemical mechanical planarization technology, particle beam polishing technology has the advantages of non-contact, optional area, and precision operation. It is a planarization technology with great application prospects in the future and is expected to be applied in the manufacturing process of semiconductor devices. . [0003] However, it is difficult to improve the accuracy of the planarization process while improving the planarization process efficiency in the process of planarizing the wafer through the currently designed planarization device supporting the particle beam polishing technology. Contents of the invention [0004] The purpose of the present invention is to provide a planarization de...

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Application Information

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IPC IPC(8): H01L21/67H01L21/263H01L21/268
Inventor 金泰源杨涛张月刘青
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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