Electromigration test circuit, electromigration test device and electromigration test method

Abstract

The invention provides an electromigration test circuit, which comprises a test module, a data acquisition module and a control module, and is characterized in that the test module is used for applying a test signal of a preset parameter to a to-be-tested sample according to an output control signal; the data acquisition module is connected with the test module and is used for acting according to the switch action signal, controlling the to-be-tested sample to be connected into a corresponding test loop and acquiring electromigration test parameter information of the to-be-tested sample; the control module is connected with the test module and the data acquisition module and is used for generating an output control signal according to the received test trigger signal so as to control the test module to generate a test signal; and / or a switch action signal is generated according to the test trigger signal to control the data acquisition module to act, so that the to-be-tested sample is connected to the corresponding test loop. In the test circuit, the service life prediction equation of the sample to be tested is generated based on the control module and the data acquisition module, the service life of the sample can be evaluated relatively accurately, and the test efficiency is greatly improved.

Description

technical field [0001] The present application relates to the field of integrated circuit reliability, in particular to an electromigration test circuit, test device and method. Background technique [0002] With the continuous development of miniaturization and multi-functionalization of electronic products, the problem of electromigration of interconnection structures in integrated circuits has become increasingly prominent, and has become an important factor affecting the reliability and durability of electronic products. The miniaturization of the size of the interconnect structure leads to a substantial increase in the current density, which accelerates the electromigration failure of the interconnect structure. [0003] The existing electromigration monitoring systems and methods basically monitor the electromigration test under the condition of DC current stress, and need to manually extract life failure data for reliability life modeling, lack of integrated reliabili...

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide an electromigration test circuit, a test device and a method for the above technical problems, so as to solve the problem that the traditional electromigration detection system and method cannot meet the life evaluation of the interconnection structure under the AC working environment

Images