Optical module
An optical module and optical emission sub-module technology, applied in the field of optical communication, can solve problems such as surface condensation, achieve the effect of preventing surface condensation and improving long-term reliability and stability
Pending Publication Date: 2022-04-22
HISENSE BROADBAND MULTIMEDIA TECH
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Problems solved by technology
[0004] This application provides an optical module to solve the problem of dew condensation on the surface of the optical device on the heat exchange surface of the TEC due to the low temperature of the non-sealed optical transmitter, especially when there is a TEC device
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[0022] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.
[0023] One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses optical signals carrying information to be transmitted in information transmission equipment such as optical fibers / optical waveguides, and the passive transmission characteristics of light in o...
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The invention discloses an optical module which comprises a circuit board, a non-airtight light emitting sub-module, a humidity sensing assembly and an MCU, the humidity sensing assembly and the MCU are arranged on the circuit board, and the non-airtight light emitting sub-module is electrically connected with the circuit board and used for emitting signal light; the humidity sensing assembly is used for detecting the environment humidity in the optical module in real time; the MCU is electrically connected with the humidity sensing assembly and the thermoelectric cooling controller in the light emission sub-module so as to receive the environment humidity detected by the humidity sensing assembly and control the temperature of the heat exchange face of the thermoelectric cooling controller according to the environment humidity. The humidity sensing assembly is arranged on the circuit board to detect the environment humidity in the optical module in real time, and the MCU controls the temperature of the heat exchange surface of the thermoelectric cooling controller according to the environment humidity, so that the temperature of the heat exchange surface of the thermoelectric cooling controller is higher than the dew point temperature under the environment humidity. It is ensured that no condensation problem occurs in the optical module in various environments, and the technical performance of the optical module is ensured.
Description
technical field [0001] The present application relates to the technical field of optical communication, and in particular to an optical module. Background technique [0002] In the development process of high-speed optical communication products, along with the improvement of transmission rate, the requirements for cost reduction are getting higher and higher. Traditional optical transmitters usually use a hermetically sealed casing, and various optoelectronic devices are packaged in the casing to ensure that there is no water vapor penetration inside the package, so that the entire optical device can work normally in a high-temperature and high-humidity environment. However, the hermetic packaging shell is expensive and cannot meet the increasingly strong demand for cost reduction. Therefore, the non-hermetic packaging method has become an important way to replace the hermetic packaging because of its lower cost and more flexible design. [0003] In the non-hermetic packag...
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IPC IPC(8): H04B10/25G05D27/02
CPCG05D27/02
Inventor 吴涛金爽慕建伟濮宏图
Owner HISENSE BROADBAND MULTIMEDIA TECH