Packaging device of shell-free capacitor

A packaging device and capacitor technology, applied in capacitors, capacitor manufacturing, circuits, etc., can solve the problems affecting product performance, affecting capacitor shock/vibration resistance and self-heating, and epoxy resin can not be fully filled, etc., to improve the quality of finished products, Overcome the effect of not fully filling

Active Publication Date: 2022-04-29
CHANGSHU GUORUI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above structure, since the epoxy material is not only used as the shell of the capacitor, but also directly affects the overall shock resistance / vibration and self-radiation performance of the capacitor, it is required that there should be no air holes during the epoxy filling process, and there must be enough In the process of filling epoxy resin, if the air cannot be completely discharged, the epoxy resin cannot be completely filled, which will affect the performance of the product.

Method used

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  • Packaging device of shell-free capacitor
  • Packaging device of shell-free capacitor
  • Packaging device of shell-free capacitor

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Embodiment Construction

[0019] The specific implementation of the present invention will be described in detail below in conjunction with the accompanying drawings, but the description of the embodiments is not a limitation on the technical solution, and any changes in form but not in substance according to the concept of the present invention should be regarded as the protection scope of the present invention.

[0020] In the following descriptions, all concepts related to the directionality (or orientation) of up, down, left, right, front and rear are for the position state of the picture being described, and the purpose is to facilitate public understanding , so it cannot be understood as a special limitation on the technical solution provided by the present invention.

[0021] see figure 1 , The present invention relates to a packaging device for a capacitor without a case, comprising a mold body 1 , a base 2 and a flash collector 3 . The mold main body 1 is supported on the base 2. The mold mai...

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Abstract

The invention discloses a packaging device for a shell-free capacitor, and belongs to the technical field of thin film capacitor packaging. Comprising a die body, a base and an overflow collector, the die body is supported on the base, a feeding pipe is arranged at one end of the top of the die body in the length direction, the lower end of the feeding pipe extends to the base, a feeding valve is arranged on the feeding pipe, an air inlet pipe and an overflow pipe are arranged at the other end of the top of the die body in the length direction, and the air inlet pipe is connected with an external air source. A pressure increasing valve and a deflation valve are arranged on the air inlet pipe, the overflow pipe is connected to one side of the overflow collector, an air outlet pipe is arranged on the other side, corresponding to the overflow pipe, of the overflow collector, a vacuum valve is arranged on the air outlet pipe, the base comprises a bottom plate and a pair of supporting legs, and a plurality of terminal positioning holes penetrating from the upper surface to the lower surface are formed in the bottom plate. And the height of the supporting leg is greater than the length of the terminal of the capacitor to be packaged. The capacitor filling machine has the advantages that enough compactness can be ensured in the capacitor filling process, the problem that materials cannot be completely filled in the filling process is solved, and the quality of finished capacitors is improved.

Description

technical field [0001] The invention belongs to the technical field of film capacitor packaging, and in particular relates to a packaging device for a caseless capacitor. Background technique [0002] Film capacitors are one of the main passive devices in the power electronics industry. They are favored by users at home and abroad for their non-polarity, high insulation resistance, excellent frequency characteristics, and small dielectric loss. Common such as support, absorption, and filtering Capacitance such as resonance and resonance are film capacitors. The current film capacitors are mainly composed of cores, packaging materials, shells, terminals and insulating materials. With the increase of the power of the power supply, the capacity of the selected capacitor also increases, and often the single-capacity core capacitor can no longer meet the capacity requirements. In order to achieve the withstand voltage, capacity and working current and other indicators of capaci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G13/00
CPCH01G13/003Y02E60/13
Inventor 毛翔宇施晓英尤伟锋
Owner CHANGSHU GUORUI TECH CO LTD
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