Cooling device for superconductor cooling container

Abstract

The invention relates to a cooling device for a superconductor cooling container. The disclosed cooling device for a superconductor cooling container is characterized by comprising: an inner container which is provided inside an outer container and in which a superconductor is immersed in a liquid coolant; a freezer provided outside the outer container and generating cold air; and an extremely low temperature maintaining device connected to the freezer and maintaining the interior of the inner container in an extremely low temperature state.

Description

technical field [0001] The invention relates to a cooling device for a superconductor cooling container. Background technique [0002] Generally, a cooling cryogenic vessel for cooling a superconductor to an extremely low temperature is made in the form of a cylinder of a vacuum insulation structure that minimizes heat inflow from the outside. The cooling cryogenic container includes: an outer container, which maintains a vacuum state; and an inner container, which is arranged inside the outer container and is used for cooling the superconductor to a very low temperature. [0003] The superconductor is cooled by immersing it in a liquid coolant mainly composed of nitrogen gas in the inner container. At this time, a cryogenic freezer is used to cool the liquid nitrogen. [0004] At this time, in order to form a compact system, a freezer is attached to the inner container, that is, the side of the nitrogen tank (the upper part of the liquid nitrogen) to generate natural conve...

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Problems solved by technology

[0005] However, in the existing process of making copper strips, as the size of the inner container increases, the difficulty of making the copper strips increases and the production costs also gradually increase, and there is a vacuum that is used for heating when brazing. The problem of the limitation of the size of the furnace (vacuumfurnace)

[0006] In addition, in the prior art, solder is used to join between the inner surface of the copper strip and the outer surface of the inner container, so it is not only difficult to confirm the welding or soldering that adheres to the inner surface of the copper strip and the outer surface of the inner container state, and in the case of abnormal bonding, it is difficult to manage quality due to a significant decrease in heat transfer efficiency, etc.

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