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Detailed general survey integrated space optical imaging system and method based on digital film imaging

A film and digital technology, applied in the field of photoelectric imaging, to reduce the pressure of digital transmission, reduce the difficulty of design, and achieve the effect of high performance indicators

Pending Publication Date: 2022-05-03
BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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Problems solved by technology

[0005] In order to solve the problem of space-based detailed census integrated optical imaging, the present invention provides a detailed census integrated space optical imaging system based on digital film imaging

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  • Detailed general survey integrated space optical imaging system and method based on digital film imaging
  • Detailed general survey integrated space optical imaging system and method based on digital film imaging

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Embodiment Construction

[0034] A detailed census integrated imaging system based on digital film imaging, using a deforming mirror-based variable resolution optical system of the field of interest, which matches the sub-micron cell size of the digital film focal surface, and the digital focal surface has supersampling function and area of interest readout function. Specifically, it comprises an optical acquisition unit 1, a deformation mirror 2, a digital film focal surface 3, a signal processing unit 4, an optical region of interest (ROI) control unit 5, a digital film focal surface region of interest (ROI) control unit 6.

[0035] Optical acquisition unit 1 has the characteristics of a small F number, and its F number should match the cell size of the digital film, and the setting of the F number is satisfied , p is the cell size, λ is the average wavelength, and k ranges [1, 1.3]; the optical system adopts the Schmidt form or the off-axis triple-inverse form.

[0036] The position of the deformation ...

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Abstract

According to the digital film imaging-based detailed general survey integrated imaging system and method, a deformable mirror in the system is located at an exit pupil position of an optical acquisition unit, and when driving voltage is not applied to the deformable mirror, the optical acquisition unit performs low-resolution imaging; when driving voltage is applied to the deformable mirror, the image quality of a local view field of the optical acquisition unit is corrected, and high-resolution optical information is obtained; the digital film focal plane converts the acquired optical information or the corrected optical information into an electric signal and then converts the electric signal into a digital signal, and the signal processing unit detects and positions an image target when receiving a low-resolution image and outputs the position of a target mass center in the image; the optical region-of-interest control unit finds a corresponding driving voltage according to the detected position of the target in the image, further sets a deformable mirror driving voltage, and collects high-resolution optical information of a local view field; and the digital film focal plane region-of-interest control unit controls the digital film focal plane to output a high-resolution image.

Description

Technical field [0001] The present invention belongs to the field of optoelectronic imaging technology, relates to a detailed census integrated spatial imaging system and method based on digital film imaging. Background [0002] In optical remote sensing imaging, it is necessary to improve the resolution and ground coverage of the camera as much as possible, but the resolution and width of the camera are difficult to achieve with traditional techniques. [0003] With the continuous development of imaging detector technology, ultra-high pixel scale and small image size device technology continue to emerge, the pixel size of the detector reaches the sub-micron level, more and more close to the particle size of the film, the sensor pixel scale is also getting larger and larger, according to the full-frame photosensitive size, 0.7μm pixel scale can reach 1.7 billion, and the current single-chip sensor The maximum area array size can reach 96mm×96mm or more, such as making it into a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B26/08
CPCG02B26/0825
Inventor 庄绪霞阮宁娟贺金平王小勇刘晓林魏久哲邹宝成胡嘉宁黄巧林王跃
Owner BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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