Power semiconductor lead frame production integrated equipment

A power semiconductor and lead frame technology, which is applied in the field of integrated equipment for the production of power semiconductor lead frames, can solve the problems of process consumption, multiple metal debris, and long time, so as to improve processing production efficiency, keep clean, and reduce workpiece transfer time Effect

Inactive Publication Date: 2022-05-06
江喜红
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For this reason, this application proposes an integrated equipment for the production of power semiconductor lead frames to solve the problem that after the stamping machine in the related art processes and produces the lead frames, there are many metal scraps left on the surface of the lead frames, and the operator needs to collect the lead frames. Transfer to the cleaning equipment for cleaning, the operation process is more cumbersome, resulting in a problem that the process takes a lot of time

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  • Power semiconductor lead frame production integrated equipment
  • Power semiconductor lead frame production integrated equipment
  • Power semiconductor lead frame production integrated equipment

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Embodiment Construction

[0041] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the application clearer, the technical solutions in the embodiments of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the application. Obviously, the described embodiments It is a part of embodiment of this application, and is not all embodiment. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

[0043] Accordingly, the following detailed description of the embodiments of the application, provided in the accompanying drawings, is not intended to limit the ...

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Abstract

The embodiment of the invention provides power semiconductor lead frame production integrated equipment, and relates to the technical field of lead frame production and processing equipment. The power semiconductor lead frame production integrated equipment comprises a punching machine, a workpiece conveying mechanism and a workpiece cleaning mechanism. The workpiece conveying mechanism comprises a machine box, a partition plate, a discharging plate, a feeding conveying assembly, a discharging conveying assembly and a middle conveying assembly, the machine box is arranged on one side of the punching machine, and a feeding port and a discharging port are formed in the two sides of the machine box respectively. When the lead frame is conveyed by the feeding conveying assembly, the discharging conveying assembly and the middle conveying assembly, the first water pump operates, and the first water pump pumps a water source in the water tank through a water inlet pipe; a water source passes through a water outlet pipe and a V-shaped drainage pipe and is finally sprayed out from a first spray head to the lead frame transported above the feeding conveying assembly, the discharging conveying assembly and the middle conveying assembly, so that impurities on the surface of the lead frame are cleaned.

Description

technical field [0001] The present application relates to the technical field of lead frame production and processing equipment, and in particular, relates to an integrated production equipment for power semiconductor lead frames. Background technique [0002] Power semiconductor devices are mainly power metal oxide semiconductor field effect transistors, insulated gate bipolar transistors and power integrated circuits. The lead frame is a structural part that forms an electrical circuit by means of gold wire, aluminum wire, copper wire, etc. to realize the electrical connection between the lead-out end of the chip's internal circuit and the outer lead wire, and mainly serves as a bridge connection. Lead frames are mainly used in semiconductor integrated blocks, and are one of the important components in the production of electronic information technology. [0003] One of the production methods of the lead frame is to use a stamping machine for stamping and forming. After ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D22/02B21D45/02B08B3/02B08B1/02B08B13/00
CPCB21D22/02B21D45/02B08B3/022B08B1/002B08B1/02B08B1/006B08B13/00
Inventor 江喜红
Owner 江喜红
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