Lead frame die changing and cutting device

Abstract

The invention discloses a lead frame die changing and cutting device which comprises a main body seat, a sliding plate is slidably connected to the upper surface of the main body seat, three dies are detachably connected to the upper surface of the sliding plate, a stamping device is arranged on the upper surface of the main body seat, and a rapid changing and cutting mechanism is arranged in the main body seat; the rapid switching mechanism comprises a sliding groove formed in the main body seat, a sliding block is slidably connected in the sliding groove, the sliding block is fixedly connected with the lower surface of the sliding plate, two sliding sleeves are fixedly connected in the main body seat in a penetrating mode, and connecting blocks are slidably connected in the sliding sleeves in a sealed mode; the two connecting blocks are fixedly connected with the two opposite side walls of the sliding block correspondingly. The die changing and cutting device has the advantages that die changing and cutting can be rapidly carried out in the continuous high-speed stamping process, so that the machining efficiency is improved, the position of the die after changing and cutting is accurate, the machining quality is guaranteed, meanwhile, part of impulsive force generated during stamping can be buffered, and the device is protected.

Description

technical field [0001] The invention relates to the technical field of lead frame processing, in particular to a lead frame mold switching device. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. During the production and processing of lead frames, the modeling of lead frames is carried out by stamping Processing, and different shapes require different molds for stamping, using a mold switching device. [0003] In the prior art, the existing mold switching devices often need to be switched ma...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems in the prior art such as the inability to switch quickly and automatically, the existence of errors, and the lack of impact buffering, etc., and propose a lead frame die switching device

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