Manufacturing process of conductive circuit

Abstract

The invention provides a manufacturing process of a conductive circuit, which comprises the following steps of: A1, providing a substrate, and planning a wiring area and a waste discharge area on the surface of the substrate; a2, covering the surface of the waste discharge area of the substrate with an isolation layer; a3, pressing the conductive layer on the surface of the substrate; a4, cutting the conducting layer into a circuit located on the surface of the wiring area and waste located on the surface of the waste discharge area through die cutting; and A5, waste materials are removed, and the conductive circuit located in the wiring area is obtained. The surface of the waste discharge area is covered with the isolation layer, so that the binding force of the conducting layer in the waste discharge area is smaller than that in the wiring area, the conducting layer is broken after die cutting, waste materials can be uniformly discharged through negative pressure suction and other modes due to the difference of the binding force, waste discharge is easy and high in efficiency, lines on the surface of the wiring area cannot be affected, and the precision is well guaranteed.

Description

technical field [0001] The invention relates to a manufacturing process of a conductive line. Background technology [0002] Integrated circuit is a kind of micro electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected and fabricated on a small or several small semiconductor chips or dielectric substrates to become a micro structure with the required circuit functions, such as circuit boards and RFID tags. Before assembling electronic components, conductive lines need to be laid out. In the prior art, the manufacturing processes of conductive lines include wet etching, printing, electroplating, vacuum plating, die cutting, etc. In the die-cutting preparation process, the whole conductive layer (such as copper foil layer) is die-cut out of the line pattern, and then the waste is discharged by the way of waste discharge, but there are some defects such as diff...

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Problems solved by technology

[0003] Therefore, based on the die-cutting process, the present invention provides a manufacturing process of conductive lines, which can well improve the problems of difficult waste discharge and poor precision.

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