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Multi-layer flexible circuit board with spacing and angle adjustable support

A flexible circuit board, angle technology, applied to the circuit layout, printed circuit, printed circuit components and other directions on the support structure, can solve the problems of height and angle cannot be adjusted, limited scope of application, poor impact resistance, etc., to achieve adjustment Easy to operate, wide application range and stable structure

Pending Publication Date: 2022-05-10
伊斯特电子科技(东台)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: in order to solve the problems existing in the above-mentioned background technology, an improved multi-layer flexible circuit board with adjustable spacing and angle brackets is provided to solve the problem that the current flexible circuit board has a simple structure and mostly adopts a single Layered structure design, the height and angle cannot be adjusted, the scope of application is limited, and the problem of poor impact resistance

Method used

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  • Multi-layer flexible circuit board with spacing and angle adjustable support
  • Multi-layer flexible circuit board with spacing and angle adjustable support
  • Multi-layer flexible circuit board with spacing and angle adjustable support

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Embodiment Construction

[0024] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0025] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral Ground connection; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

[0026] figure 1 , figure 2 and image 3 A multi-layer flexible circuit board with adjustable...

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Abstract

The invention relates to the technical field of circuit board stacking, in particular to a multi-layer flexible circuit board with an interval and angle adjustable support, which comprises a first flexible circuit board body and a second flexible circuit board body. According to the multi-layer flexible circuit board with the support adjustable in distance and angle, the multi-layer structure design is adopted, the adjacent flexible circuit board bodies are connected and assembled through the elastic metal strips, stacking of the flexible circuit boards is facilitated, and the application range of the multi-layer flexible circuit board is wider; the angle of the elastic metal strip is changed by adjusting the internal extrusion frame in the lateral clamping frame, so that the distance between different flexible circuit boards is adjustable, the installation application range of the flexible circuit board is wider, and the adjustment operation is more convenient; by changing the installation mode of the internal extrusion frame, the distance between different flexible circuit boards can be adjusted, and the firmness and stability of the circuit boards in the stacked state can be improved.

Description

technical field [0001] The invention relates to the technical field of circuit board stacking, in particular to a multilayer flexible circuit board with adjustable spacing and angle brackets. Background technique [0002] Flexible circuit boards, also known as flexible circuit boards and flexible circuit boards, are favored for their light weight, thin thickness, and free bending and folding. With the rapid development of the electronics industry, the design of circuit boards tends to be more and more high-precision and high-density. The traditional manual inspection methods can no longer meet the production needs. The automatic detection of FPC defects has become an inevitable trend of industrial development. [0003] Flexible circuit is a technology developed for the development of aerospace rocket technology. It is a highly reliable and extremely flexible printed circuit made of polyester film or polyimide. On the thin and light plastic sheet, the circuit design is embed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K1/02H05K7/02
CPCH05K1/147H05K1/0298H05K7/023
Inventor 任瑞红陈金官
Owner 伊斯特电子科技(东台)有限公司
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