BGA chip ball mounting production line

Abstract

The invention particularly discloses a BGA chip ball mounting production line. The BGA chip ball mounting production line comprises a feeding device, a printing device, a ball mounting device and a laminating device which are sequentially arranged along the production line; wherein the feeding device is used for placing a BGA (Ball Grid Array) into the jig and conveying the jig loaded with the BGA to the printing device; the printing device is provided with a conveying flow channel, and the conveying flow channel can convey the printed BGA to the ball mounting device; the ball mounting device is used for carrying out ball mounting operation on the printed BGA and conveying the ball-mounted BGA to the laminating device; the attaching device is used for attaching the BGA to the corresponding position of the PCB. According to the invention, the purposes of automatic feeding, ball supply and surface mounting can be achieved, and the automation degree is improved; and meanwhile, a production line reasonable in layout is formed, manual interference in the whole production process is small, the production efficiency is greatly improved, and the quality of produced products is good.

Description

technical field [0001] The invention relates to the technical field of BGA ball planting, in particular to a BGA chip ball planting production line. Background technique [0002] With the advent of the information age, the electronic information industry has developed rapidly around the world. Electronic information products have become a necessity in people's lives. The development of the electronic information industry has brought many conveniences to human life. With the rapid development of the electronics industry, the integration capability of electronic products is constantly improving, and the functions are becoming more and more powerful while the volume is becoming smaller and smaller. The layout of electronic components is becoming more and more compact, and the process requirements for BGA are also increasing. The existing traditional ball planting process-based template method and ball planting method, through manual balling, manual bonding and manual fixture T...

AI Technical Summary

Problems solved by technology

The layout of electronic components is becoming more and more compact, and the process requirements for BGA are also increasing. The existing traditional ball planting process-based template method and ball planting method, through manual balling, manual lamination and manual fixture The method not only needs to add a lot of manpower and material resources in the process of ball planting, but also leads to the low yield rate of ball planting and consumes a lot of time. There are also great disadvantages

In addition, the layout of the traditional BGA chip ball planting production line is unreasonable, the production efficiency is low, and the quality of the produced products is not good enough to be guaranteed

With the improvement of process requirements, it is difficult for the traditional ball planting production line to meet the automation performance of the existing ball planting equipment

Images