Die, method and device for detecting internal stress of adhesive

A technology for detecting molds and detection methods, which is applied in the field of detection, can solve problems such as internal stress monitoring, and achieve the effect of optimizing the post-curing treatment process of adhesives

Pending Publication Date: 2022-05-13
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide an adhesive internal stress detection mold, method and devi

Method used

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  • Die, method and device for detecting internal stress of adhesive
  • Die, method and device for detecting internal stress of adhesive
  • Die, method and device for detecting internal stress of adhesive

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Embodiment Construction

[0058] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0059] The embodiment of the present invention aims at the internal stress monitoring problem in the adhesive curing process and the post-processing process in the prior art, and provides an adhesive internal stress detection mold, method and device.

[0060] Such as Figure 1 to Figure 5 As shown, an embodiment of the present invention provides a kind of adhesive internal stress detection mold, comprising:

[0061] The mold body, the inner cavity of the mold body is used to hold the adhesive 1;

[0062] At least one strain sensor 2 is fixedly connected to the mold body and immersed in the adhesive 1 contained in the inner cavity for collecting strain signals of the adhesive 1 .

[0063] It should be noted that the strain sensor 2 is a fiber grating st...

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Abstract

The invention provides an adhesive internal stress detection mold, method and device, and relates to the technical field of detection, the adhesive internal stress detection mold comprises: a mold body, an internal cavity of which is used for containing an adhesive; and the at least one strain sensor is fixedly connected with the mold body, is immersed in the adhesive contained in the inner cavity, and is used for acquiring a strain signal of the adhesive. According to the scheme, internal stress monitoring in the adhesive curing process can be achieved.

Description

technical field [0001] The invention belongs to the technical field of detection, and in particular relates to an adhesive internal stress detection mold, method and device. Background technique [0002] Adhesives are widely used in aerospace, military industry and transportation industry and other fields. With the popularization of the application of adhesives, the verification of adhesive curing industrial parameters and the optimization of post-curing treatment process have become the focus of adhesive research and development and adhesive structure research. Therefore, it is very important to provide a strain monitoring method for the adhesive curing process to carry out the research on the adhesive curing process. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide an adhesive internal stress detection mold, method and device, so as to solve the problem of internal stress monitoring in the adhesive curing process a...

Claims

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Application Information

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IPC IPC(8): G01N19/00G01N1/36G01L1/24
CPCG01N19/00G01N1/36G01L1/246G01N2001/366
Inventor 郭磊刘检华夏焕雄罗俊成敖晓辉
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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