Load-in and load-out cavity and etching equipment system

Abstract

The invention provides a load-in and load-out cavity and an etching equipment system. The load-in and load-out cavity comprises a cavity body, a bearing structure and a pipeline structure, the cavity body is provided with an air inlet and an air outlet; the bearing structure is located in the cavity body, the bearing structure can form at least one placement layer which is arranged at intervals in the vertical direction, and the placement layer is used for bearing wafers; the pipeline structure comprises an air inlet pipe section, an air distributing pipe section and at least one air outlet pipe section. One end of the air inlet pipe section is positioned within the range of the air inlet; the other end of the air inlet pipe section is communicated with the air distributing pipe section which is communicated with the air outlet pipe section; and at least one air outlet pipe section is arranged within the range of the placement layer. According to the configuration, each placement layer can be provided with at least one gas outlet pipe section by adding the pipeline structure, so that wafers on each placement layer can be aligned and purged by nitrogen from the gas outlet pipe section, the discharge efficiency of residual gas on the wafers is improved, and the defect rate of the wafers is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a loading and unloading cavity and an etching equipment system. Background technique [0002] In a semiconductor manufacturing plant, the main equipment is manufacturing equipment, and most of the manufacturing equipment has a loading and unloading chamber for fixedly placing the wafer, and finally moving the wafer to the process chamber for dry etching. figure 1 is a schematic diagram of a wafer with defects, such as figure 1 As shown, as the size of the wafer 01 becomes larger and larger, the surface of the wafer 01 is also larger and larger, and the wafer 01 after etching is located in the loading and unloading chamber, and the wafer 01 itself will volatilize Residual gas 02, if the residual gas cannot be removed in time, the upper and lower adjacent wafers will affect each other, which will easily cause wafer defects 010. [0003] The current loading and unloading ch...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a loading and unloading chamber and etching equipment system to solve the problem of low exhaust efficiency of residual gas on the wafer during loading and unloading

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