Load-in and load-out cavity and etching equipment system

A technology of load-out and gas-out pipes, which is applied in the field of load-in and out chambers and etching equipment systems, can solve the problem of low exhaust efficiency of residual gas, achieve the effect of reducing wafer defect rate and improving exhaust efficiency

Pending Publication Date: 2022-05-13
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a loading and unloading chamber and etching equipment

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  • Load-in and load-out cavity and etching equipment system
  • Load-in and load-out cavity and etching equipment system
  • Load-in and load-out cavity and etching equipment system

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[0030]To make the object, advantages and features of the present invention more clear, the present invention will be further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are in a very simplified form and are not drawn to scale, only for the purpose of conveniently and clearly assisting in illustrating the embodiments of the present invention. Further, the structure shown in the drawings is often part of the actual structure. In particular, each drawing needs to show different emphases, sometimes using different proportions.

[0031] As used in the present invention, the singular forms "one", "one" and "the" include plural objects, the term "or" is generally used in the sense of comprising "and / or", the term "several" is usually used to include the meaning of "at least one", the term "at least two" is usually used to include "two or more" meaning, in addition, the term "first", "second", "...

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Abstract

The invention provides a load-in and load-out cavity and an etching equipment system. The load-in and load-out cavity comprises a cavity body, a bearing structure and a pipeline structure, the cavity body is provided with an air inlet and an air outlet; the bearing structure is located in the cavity body, the bearing structure can form at least one placement layer which is arranged at intervals in the vertical direction, and the placement layer is used for bearing wafers; the pipeline structure comprises an air inlet pipe section, an air distributing pipe section and at least one air outlet pipe section. One end of the air inlet pipe section is positioned within the range of the air inlet; the other end of the air inlet pipe section is communicated with the air distributing pipe section which is communicated with the air outlet pipe section; and at least one air outlet pipe section is arranged within the range of the placement layer. According to the configuration, each placement layer can be provided with at least one gas outlet pipe section by adding the pipeline structure, so that wafers on each placement layer can be aligned and purged by nitrogen from the gas outlet pipe section, the discharge efficiency of residual gas on the wafers is improved, and the defect rate of the wafers is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a loading and unloading cavity and an etching equipment system. Background technique [0002] In a semiconductor manufacturing plant, the main equipment is manufacturing equipment, and most of the manufacturing equipment has a loading and unloading chamber for fixedly placing the wafer, and finally moving the wafer to the process chamber for dry etching. figure 1 is a schematic diagram of a wafer with defects, such as figure 1 As shown, as the size of the wafer 01 becomes larger and larger, the surface of the wafer 01 is also larger and larger, and the wafer 01 after etching is located in the loading and unloading chamber, and the wafer 01 itself will volatilize Residual gas 02, if the residual gas cannot be removed in time, the upper and lower adjacent wafers will affect each other, which will easily cause wafer defects 010. [0003] The current loading and unloading ch...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67201H01L21/67069
Inventor 邓必文
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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