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Unit flow path, heat exchanger design method and liquid cooling plate

A technology of heat exchanger and liquid cold plate, applied in the field of unit flow path, heat exchanger design method, and liquid cold plate, which can solve the design characteristics and performance that are difficult to meet the cooling requirements, strengthen the local heat exchange capacity, and waste the heat capacity of the cooling liquid and other issues, to achieve the effect of intensive utilization of resources, large power capacity, and compact volume

Active Publication Date: 2022-05-20
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has been found in engineering practice that the liquid-cooled plate designed for uniform temperature cannot strengthen the local heat transfer capacity for local high heat flux point heat sources, resulting in overheating in some areas and underheating in other areas, wasting the heat capacity of the cooling liquid
Its design features and performance are difficult to meet the cooling requirements of certain types of electronic modules with the characteristics of distributed point heat sources

Method used

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  • Unit flow path, heat exchanger design method and liquid cooling plate
  • Unit flow path, heat exchanger design method and liquid cooling plate
  • Unit flow path, heat exchanger design method and liquid cooling plate

Examples

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Embodiment 1

[0033] see figure 1 , is a schematic diagram of a unit flow circuit consisting only of a heat exchanger and a flow divider in an embodiment of the present invention, including: a heat exchanger group composed of two heat exchangers connected in parallel and two flow dividers; a flow divider is located in the heat exchanger upstream of the diverter group, another splitter is located downstream of the heat exchanger group upside down, forming a flow path topology of splitter-heat exchanger group-splitter; see Figure 4(a), the heat exchanger has an asymmetric upper The downstream structure corresponds geometrically to the power device to be cooled.

[0034] In this embodiment, the upstream structure of the heat exchanger is a diffuser 3 with a large expansion angle, the expansion angle a of the diffuser 3 is between 120° and 150°, and the rounded corners are designed to smoothly transition at the turning point of the contour ; The downstream structure of the heat exchanger is a ...

Embodiment 2

[0039] In view of the characteristics of high heat flux density and high power in power devices, it is necessary to use micro-channel heat exchangers to enhance cooling capacity. In order to adapt to the laminar flow characteristics of microchannel heat transfer and effectively use the higher convective heat transfer coefficient of laminar flow in the non-fully developed section. see figure 2 , image 3 , Fig. 4 (a) and Fig. 4 (b), the present invention provides a kind of embodiment that adapts to the heat exchanger design method of the laminar flow characteristic of microchannel heat transfer, is applicable to the heat exchanger in embodiment one, exchanging The heat exchanger also includes a heat exchange area 4 which is formed by alternately arranging several microchannels and cooling teeth. The heat exchange area 4 is rectangular along the flow direction, with the long side of the rectangle along the flow direction and the short side of the rectangle along the flow direc...

Embodiment 3

[0062] see Figure 5 , Figure 6 and Figure 7 ,in, Figure 7 The A-A sectional view and the B-B sectional view of the liquid-cooled plate structure are given. As an application of the unit flow path, the present invention provides an embodiment of a liquid cold plate. The liquid cold plate includes a plurality of unit flow paths in the above-mentioned embodiment 1 connected in series. The number of unit flow paths can be determined according to the number of power devices And increase or decrease. see Figure 6 , the liquid cold plate is in contact with the power device to be cooled, specifically, the heat exchanger in the liquid cold plate corresponds to the position of the power device.

[0063] As the simplest example, the number of unit flow paths is 2; a single-return flow consisting of 2 unit flow paths, an interstage section, a liquid inlet chamber, a liquid outlet chamber, the first drainage section and the second drainage section The liquid inlet and the liquid...

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Abstract

The invention discloses a unit flow path, a heat exchanger design method and a liquid cooling plate. The unit flow path comprises a heat exchanger group and two diverters, wherein the heat exchanger group is formed by connecting two heat exchangers in parallel; one flow divider is positioned at the upstream of the heat exchanger group, and the other flow divider is inversely positioned at the downstream of the heat exchanger group, so that a flow divider-heat exchanger group-flow divider flow path topological structure is formed; the heat exchanger is provided with an asymmetric upstream and downstream structure and corresponds to a power device to be cooled in geometric position. The heat exchanger has the advantages of being high in heat exchange efficiency, large in power capacity, compact in size and capable of intensively utilizing resources, flow paths can be flexibly adjusted according to the layout characteristics of power devices, the heat exchanger is particularly suitable for solving the cooling problem of high-heat-flux and high-power electronic modules, and the problem of array application of the electronic modules is solved.

Description

technical field [0001] The invention relates to the thermal management and structural design suitable for miniaturized electronic equipment, and is used in the technical field of cooling high heat flux density power devices, in particular to a unit flow path, a heat exchanger design method, and a liquid cold plate. Background technique [0002] A cooling plate is a derivative of a heat exchanger and is used to exchange heat between solids and fluids. At present, the multi-return channel integral liquid cold plate is the mainstream form for heat dissipation of high-power electrical, electronic, and power equipment. Its design principle is aimed at the uniform temperature design of a large-area uniform heat source and maximizing the use of the heat side area, which can realize the electronic module (or electrical module, which is collectively referred to as the electronic module for simplified description below) with medium heat dissipation power and medium heat flux density. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20927H05K7/20272
Inventor 任川褚鑫祁成武
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP