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Cooling device for chip production and manufacturing

A cooling device and chip technology, which is applied to household refrigeration devices, cooling fluid circulation devices, refrigerators, etc., can solve problems such as unfavorable promotion and use of cooling devices, unsatisfactory chip cooling effect, and inability to efficiently dissipate heat from chips, and achieve a simple structure. , Improve processing efficiency, good cooling effect

Active Publication Date: 2022-05-24
江苏晶曌半导体有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004]However, the cooling device cannot efficiently dissipate heat from the chip at the bottom of the device when in use, and it takes a long time for the cooling device to cool the chip, making the cooling The cooling effect of the device on the chip is not ideal, which is not conducive to the promotion and use of the cooling device

Method used

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  • Cooling device for chip production and manufacturing
  • Cooling device for chip production and manufacturing
  • Cooling device for chip production and manufacturing

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Embodiment Construction

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] In the description of this patent, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected" and "arranged" should be understood in a broad sense. , it can also be detachably connected and set, or integrally connected and set.

[0025] For those of ordinary skill in the art, the specific meanings of the above terms in this patent can be understood according to sp...

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Abstract

The invention discloses a cooling device for chip production and manufacturing, and belongs to the technical field of chip processing, the cooling device comprises a limiting frame, the limiting frame is internally provided with an air cooling mechanism for cooling a chip, the limiting frame is also internally provided with a cooling mechanism, and the limiting frame is internally provided with a cooling mechanism. The cooling mechanism comprises a placing assembly used for placing and cooling the chip, a height adjusting assembly used for being matched with the limiting frame to adjust the height of the placing assembly, and a position adjusting assembly used for being matched with the limiting frame and the placing assembly to adjust the height of the air cooling mechanism. The cooling device is simple in structure and convenient to use, during use, through linkage cooperation of multiple structures, the cooling device can efficiently cool chips placed in the device without dead corners, the cooling effect of the cooling device on the chips is better, the time consumed by a user for cooling the chips can be effectively shortened, and the machining efficiency of the user is improved.

Description

technical field [0001] The invention belongs to the technical field of chip processing, and in particular relates to a cooling device for chip production. Background technique [0002] Chip is a general term for semiconductor component products. Chips are widely used in many electronic devices such as mobile phones and computers, enabling electronic devices to realize complex and diverse data processing. Chips will generate heat during the manufacturing process, and cooling is required at this time. The device cools the chip; [0003] The traditional cooling device for chip manufacturing includes structures such as a support plate, a fixed rod, a fan, a motor, and a rotating rod. The advantage of this cooling device is that it can cool the chip; [0004] However, the cooling device cannot efficiently dissipate heat to the chip located at the bottom of the device when in use, so that it takes a long time for the cooling device to cool the chip, so that the cooling effect of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25D11/00F25D17/06F25D19/00F25D25/02F25B21/02
CPCF25D11/00F25D17/06F25D19/00F25D25/027F25B21/02
Inventor 白俊春王冲程斌平家峰王晨宁
Owner 江苏晶曌半导体有限公司
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