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Equipment for cleaning polishing pad and polishing device

A technology of polishing device and polishing pad, which is applied in the direction of grinding/polishing equipment, grinding device, metal processing equipment, etc. It can solve the problems of poor cleaning, foreign matter 5 or slurry particles that are difficult to remove, and achieve the effect of improving cleanliness

Pending Publication Date: 2022-05-27
LG SILTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, foreign objects 5 or slurry particles in the holes 3 are not easily removed, resulting in poor cleaning
[0011] In particular, since the nozzle 7 is sprayed vertically relative to the polishing pad 1 in the prior art, the foreign matter 5 or slurry particles in the hole 3 are more difficult to remove

Method used

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  • Equipment for cleaning polishing pad and polishing device
  • Equipment for cleaning polishing pad and polishing device
  • Equipment for cleaning polishing pad and polishing device

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0062] image 3 are plan views showing the apparatus for cleaning polishing pads according to the first embodiment, and Figure 4 is a side view showing the apparatus for cleaning the polishing pad according to the first embodiment.

[0063] refer to image 3 , the apparatus 170 for cleaning a polishing pad according to the first embodiment may include a first gas nozzle 211 and a liquid nozzle 221 .

[0064] The first gas nozzle 211 may spray gas to the holes 121 of the polishing pad 120 . The gas can be injected at high pressure and high velocity. The gas may be, for example, air, but is not limited thereto.

[0065] The liquid nozzles 221 may spray liquid to the holes 121 of the polishing pad 120 . Liquids can be ejected at high pressure and high speed. The liquid may be, for example, but not limited to, DI water.

[0066] The liquid nozzle 221 may be arranged adjacent to the first gas nozzle 211 . The liquid nozzle 221 can be rotated 360 degrees around a vertical a...

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PUM

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Abstract

The present invention relates to an apparatus for cleaning a polishing pad and a polishing apparatus, the apparatus for cleaning a polishing pad comprising: a first gas nozzle for injecting a gas to a hole of a polishing pad; and a first liquid nozzle for spraying a liquid to the hole of the polishing pad.

Description

technical field [0001] This embodiment relates to an apparatus for cleaning a polishing pad and a polishing apparatus. Background technique [0002] Generally, a wafer widely used as a material for manufacturing semiconductor devices refers to a single crystal silicon thin plate made of polycrystalline silicon as a raw material. [0003] Such wafers include a slicing process that grows polycrystalline silicon into a single crystal silicon ingot and then cuts the ingot into a wafer shape, a grinding process that uniforms and flattens the thickness of the wafer, and etching that removes or mitigates damage caused by mechanical polishing process, the polishing process to make the wafer surface mirror, and the cleaning process to clean the wafer. [0004] In general, the polishing process is a very important process because the polishing process is the process of finalizing flatness and surface roughness before the wafer enters the device process. [0005] The polishing proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/34
CPCB24B37/34B24B53/003B24B53/017B24B37/26H01L21/67092
Inventor 曹志焕
Owner LG SILTRON