Laminated metal flow path member and method for manufacturing same
A technology of metal lamination and flow path components, which is applied in metal material coating process, semiconductor/solid-state device manufacturing, coating, etc., which can solve problems such as difficult processing, high price, and high cost of fluid supply pipelines
Pending Publication Date: 2022-05-27
株式会社博迈立铖
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- Description
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- Application Information
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Problems solved by technology
Such members and devices are often expensive due to the difficulty of processing, which contributes to the high cost of fluid supply pipeline construction.
Method used
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[0095] Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. In addition, this invention is not limited to these Examples.
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Abstract
The purpose of the present invention is to provide a metal-laminate-molded flow path member having both the surface roughness and corrosion resistance of the inner surface of a flow path at a level that can be used as a flow path member used in a supply line for a corrosive fluid in a semiconductor device manufacturing apparatus. A metal laminate flow path member in which a corrosive fluid flows, the metal laminate flow path member being characterized in that: a metal base constituting the metal laminate flow path member has surface irregularities, and the surface irregularities of the surface irregularities of the surface irregularities of the surface irregularities of the surface irregularities of the surface irregularities of the surface irregularities; a glass coating layer is formed on the inner surface of the flow path of the metal laminate molding flow path member so as to fill at least a concave region of the surface irregularities of the metal base, and the glass coating layer contains at least one of a P2O5-ZnO-Al2O3-based glass layer, a Bi2O3-ZnO-B2O3-based glass layer, and a SiO2-B2O3-Na2O-based glass layer.
Description
technical field [0001] The present invention relates to a technique of a flow path member through which a corrosive fluid (gas or liquid) circulates used in a semiconductor device manufacturing process or the like, and particularly relates to a metal lamination molding flow path member manufactured by a metal lamination molding method. Background technique [0002] With the continuous development of high-integration technology of semiconductor devices, the wiring pitch of circuits is getting smaller and smaller. In order to secure high manufacturing yield in such a semiconductor device, for example, precise control of the amount of supply gas in the manufacturing process and cleaning of supply gas lines are indispensable technologies. [0003] The surface smoothness of the inner surface (also referred to as the contact surface) of the gas flow path is one of the most important factors in the precise control of the supply gas amount and the cleaning of the supply gas line. A...
Claims
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IPC IPC(8): C23D5/04
CPCC23D5/04B22F5/10B33Y80/00B33Y10/00C03C8/16F16L9/02F16L58/14C23D5/02B05D7/222B22F10/28B22F10/25B22F2003/242B22F10/62C03C3/17C03C3/066C03C3/091C03C3/21C03C4/20C03C2217/77C03C2217/78B22F3/105B22F3/16B22F3/24B22F5/12C23C26/00F16L9/14H01L21/304H01L21/3065B22F2003/166C03C27/02C03C2203/52
Inventor 宫田素之青柳拓也太期雄三三宅龙也内藤孝
Owner 株式会社博迈立铖



