Laser and laser projection equipment

Abstract

The invention discloses a laser device and laser projection equipment. The laser device comprises a tube shell; the tube shell comprises a bottom plate and an annular side wall located on the bottom plate, and the bottom plate and the annular side wall form a containing space. The plurality of laser chip assemblies are fixed on the bottom plate of the tube shell; the plurality of pins are fixed on the annular side wall of the tube shell; one end of each pin is located outside the tube shell, and the other end of each pin extends into the containing space. A plurality of adapters are arranged in a tube shell, and the height of one side, close to a corresponding pin, of each adapter is larger than that of one side, close to a corresponding laser chip assembly, of each adapter, so that the pins can be connected with the higher sides of the adapters, and the laser chip assemblies are connected with the lower sides of the adapters; therefore, the length of the gold thread among the pin, the laser chip assembly and the adapter is shortened, and higher reliability is realized while current conduction between the pin and the laser chip assembly is ensured.

Description

technical field [0001] The present invention relates to the technical field of laser projection display, in particular to a laser and laser projection equipment. Background technique [0002] At present, the development of the laser projection industry is very rapid, and the laser, as one of the core components, plays an irreplaceable role. Semiconductor lasers are packaged after the chips are produced. Therefore, the packaging capability of the laser has a very significant impact on the application, cost, performance and other indicators of the laser. [0003] In the current multi-chip laser packaging system, it is necessary to use wire bonding (Wire Bonding, WB for short) to realize circuit connection. The pins are then connected to the laser chip assembly through gold wires. Because there is a certain distance between the pins and the laser chip components, and there is a large height difference, the length of the gold wire is greatly increased during WB. When the curr...

AI Technical Summary

Problems solved by technology

Because there is a certain distance between the pin and the laser chip component, and there is a large difference in height, the length of the gold wire is greatly increased during WB. When the current increases, the risk of gold wire melting is greater, reliable poor sex

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