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A wafer transfer device and semiconductor equipment

A transfer device and wafer technology, applied in semiconductor/solid-state device manufacturing, transportation and packaging, conveyor objects, etc., can solve problems such as wafer jitter, ensure cleanliness, ensure yield, and improve wafer transfer efficiency Effect

Active Publication Date: 2022-08-02
ZHICHENG SEMICON EQUIP TECH (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to disclose a wafer transfer device and semiconductor equipment, which is used to solve the technical problem of wafer shaking in the process of wafer support and transportation in semiconductor equipment in the prior art, and at the same time Realize the collection of impurities and volatiles during the operation of the wafer transfer device to ensure the cleanliness inside the semiconductor equipment

Method used

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  • A wafer transfer device and semiconductor equipment
  • A wafer transfer device and semiconductor equipment
  • A wafer transfer device and semiconductor equipment

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Embodiment 1

[0046] The present embodiment discloses a wafer transfer device, which is used to transfer wafers between various process points built in a semiconductor equipment to meet the transfer requirements of wafers in different semiconductor processes.

[0047] In the present embodiment, the wafer transfer device can be built into the frame of the semiconductor equipment, and simultaneously performs the process of transferring the two wafers 80 (refer to Figure 5 The upper wafer 81 and the lower wafer 82 ) perform a pick-up operation and a wafer-release operation, so as to improve the transfer efficiency of the wafer 80 . Specifically, the wafer transfer device includes: a lifting mechanism 10, a cantilever 20 driven by the lifting mechanism 10 and moving in a vertical direction, a rotating mechanism 22 disposed at the end of the cantilever 20, a robot 30 driven by the rotating mechanism 22, and a base 40. The base 40 is fixedly mounted on the frame (not shown). Generally, a clean...

Embodiment 2

[0067] Based on the specific technical solution of the wafer transfer device disclosed in the first embodiment, this embodiment also discloses a semiconductor device.

[0068] The semiconductor equipment includes: at least one wafer transfer device as described in the first embodiment. The semiconductor equipment includes, but is not limited to, wafer lithography equipment, wafer uniformity and development equipment, wafer etching equipment, wafer cleaning equipment, etc., so as to transfer the wafer to any of the aforementioned semiconductor equipment through the aforementioned wafer transfer device. Wafers are transferred between various process units, between a process unit and a wafer buffer device (not shown), and between a process unit and a FOUP (FOUP). The aforementioned process units include, but are not limited to, cleaning tanks, glue dispensing chambers, developing chambers, etching chambers, and the like.

[0069] The technical solutions on which one or more wafe...

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Abstract

The invention provides a wafer transfer device and semiconductor equipment. The wafer transfer device includes a lifting mechanism, a cantilever, a rotating mechanism disposed at the end of the cantilever, a manipulator and a base. The lifting mechanism includes a cover that encloses a first shielding cavity The rotating mechanism includes a first driving device that integrally drives the manipulator to rotate, a rotating mechanism casing enclosing the first driving device, and a hollow plate with a number of air holes is arranged at the bottom of the rotating mechanism casing; the cantilever includes a cantilever seat, which encloses a second The cantilever casing that shields the cavity and the first fan arranged inside the cantilever casing, the cantilever casing at least partially covers the air holes of the hollow plate, the cantilever seat forms a first suction hole that communicates with the first shielding cavity of the lifting mechanism, and the second A fan sucks the air in the cantilever housing and exhausts it into the first shielding cavity. Through the present application, the cleanliness of the wafer transfer device and the interior of the semiconductor equipment is improved, and jitter during the wafer transfer process is avoided.

Description

technical field [0001] The present invention relates to the technical field of semiconductor equipment, and in particular, to a wafer transfer device and semiconductor equipment. Background technique [0002] Transmission manipulators are often used in automation equipment to transfer materials, but in the process of using transmission manipulators in the prior art, due to the relative movement of gears, guide rails, motors, belts and other components, pollution such as particles will be generated. [0003] After searching, the applicant found that the Chinese invention patent with publication number CN109244022A discloses a manipulator end effector. The joint motor in the prior art will generate pollution such as particulate matter during the execution of the rotating action and the lifting action; at the same time, since the lubricating grease coated on the guide rail needs to be lubricated, it will also generate high temperature due to friction, which leads to Partial vo...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01L21/677
CPCH01L21/68707H01L21/67706H01L21/67742
Inventor 顾雪平时新宇
Owner ZHICHENG SEMICON EQUIP TECH (KUNSHAN) CO LTD
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