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A chip lead welding defect detector based on reduction performance

A welding defect and detector technology, applied in instruments, measuring devices, scientific instruments, etc., can solve the problems of chip damage, non-conductivity, low observation efficiency, etc., and achieve the effect of improving the detection rate and accelerating oxidation.

Active Publication Date: 2022-08-02
深圳市禾川兴科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above situation, in order to overcome the defects of the existing technology, this scheme provides a chip pin welding defect detector based on reduction performance, aiming at the problem of low efficiency in observing the chip pin welding parts, creatively integrates the self-adjusting structure and fine-tuning structure Combined with the aerosol effect, under the intervention of the reduction performance, through the multi-angle direct-radiation chip rotation detection mechanism and the anti-reflective defect oxidation type dual-gas action mechanism, it realizes all-round and comprehensive detection of chip pin welding defects. The high-accuracy detection greatly improves the detection efficiency of the chip, and solves the problem that the existing technology is difficult to solve. Trouble), and do not quickly oxidize the solder (the metal copper parts contained in the chip will also oxidize when the solder is oxidized, and the copper oxide produced by the oxidation of metal copper has no electrical conductivity, thus causing chip damage) contradictory technology At the same time, the waste gas generated during the chip detection process is recycled;

Method used

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  • A chip lead welding defect detector based on reduction performance
  • A chip lead welding defect detector based on reduction performance
  • A chip lead welding defect detector based on reduction performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] In the first embodiment, the chip to be detected is positioned and clamped, and the solder is quickly de-lighted.

[0039]Specifically, in the initial state, the sealing door 41 is in the open state, the chip to be detected is placed in the clamping frame 53, the clamping plate 55 is driven by the elastic deformation of the spring 54 to move the clamping plate 55 against each other, and the chip is placed in the clamping frame 53. Between the holding plates 55, the spring 54 elastically resets and drives the clamping plate 55 to clamp the chip. After the chip pins are welded, the solder remains in the air for a short time, and the surface of the solder is relatively shiny. During the fill light inspection, the solder surface will reflect light, which makes it difficult for the camera lens to accurately detect the defects of the soldered parts on the chip. At this time, the sealing door 41 is pushed, and the sealing door 41 is rotated around the door shaft 39 through the ...

Embodiment 2

[0040] The second embodiment, based on the above-mentioned embodiment, performs defect detection on the processed chip.

[0041] Specifically, manually rotate the lock nut 24 in the positive direction, the lock nut 24 moves along the external thread 23 and is fitted with the rotating sleeve 21, so that the clamping frame 53 is fixed by the fine adjustment shaft, and the control panel 56 controls the drive motor 17 to rotate, The drive motor 17 drives the drive gear 18 to rotate through the power end, the drive gear 18 meshes with the ring rack 15, the drive gear 18 drives the ring rack 15 to rotate, the ring rack 15 drives the chip to rotate through the gear plate 14, and the control panel 56 controls the light source Turn on, the illumination lamp 10 illuminates the detection environment, the detection lens 8 shoots and detects the chip, the detection lens 8 transmits the detected information to the control panel 56, and the operator observes the defects of the solder at the p...

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Abstract

The invention discloses a chip lead welding defect detector based on reduction performance, comprising a base plate, a support column, a detection cylinder, a multi-angle direct-light chip rotation detection mechanism and an anti-reflection defect oxidation type double-air action mechanism. The support column is arranged on the upper wall of the bottom plate, the detection tube is arranged on the upper wall of the support column, the detection tube is arranged through, the light multi-angle direct type chip rotation detection mechanism is arranged on the inner wall of the detection tube, the anti-reflection defect The oxidation-type double-air action mechanism is arranged on the side wall of the support column. The invention belongs to the technical field of chip detection, and specifically refers to a reduction performance-based chip lead welding defect detector; the invention provides a method capable of oxidizing solder while avoiding oxidation of metal copper, thereby realizing no reflection on the chip. Detection based on reduction performance chip lead welding defect detector.

Description

technical field [0001] The invention belongs to the technical field of chip detection, in particular to a reduction performance-based chip lead welding defect detector. Background technique [0002] The integrated circuit board is one of the indispensable basic components in electronic products. The welding quality of the chip pins on the integrated circuit board is an important factor in evaluating the quality of the integrated circuit board. The quality of the chip pin welding directly determines the quality of the chip pins. The quality of integrated circuit boards and electronic products. Therefore, during the production process of the integrated circuit board, it is necessary to carry out multiple inspection procedures for the welding quality of the chip pins. [0003] At present, the existing chip pin welding inspection equipment has the following problems: [0004] 1. In some places where the shadows are not very obvious, it is more prone to misjudgment. Some compon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/956G01N21/01G01N1/28
CPCG01N21/956G01N21/01G01N1/28G01N2021/95646
Inventor 吴海兵彭奉贵周统政李文龙
Owner 深圳市禾川兴科技有限公司