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Fault diagnosis chip, method and system and storage medium

A fault diagnosis and chip technology, which is applied in the direction of instruments, measuring devices, and measuring electronics, can solve problems such as the accuracy of fault diagnosis and the impact of timeliness, so as to ensure synchronization and acquisition frequency, improve timeliness and accuracy, and improve quality effect

Pending Publication Date: 2022-06-21
深圳锂安技术有限公司
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Problems solved by technology

[0003] However, in the above method, since the early warning mechanism is set on the remote platform side, it will affect the accuracy and timeliness of fault diagnosis

Method used

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  • Fault diagnosis chip, method and system and storage medium
  • Fault diagnosis chip, method and system and storage medium
  • Fault diagnosis chip, method and system and storage medium

Examples

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Embodiment Construction

[0045] The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention.

[0046] In the description of the present invention, it should be understood that the azimuth description, such as the azimuth or position relationship indicated by up, down, front, rear, left, right, etc., is based on the azimuth or position relationship shown in the drawings, only In order to facilitate the description of the present invention and simplify the description, it is not indicated or implied that the indicated device or element must have a particular orientation, be construc...

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Abstract

The invention discloses a fault diagnosis chip, method and system and a storage medium. Wherein the fault diagnosis chip comprises a first communication module, the first communication module is used for being in wired connection with a battery system, and the first communication module is used for obtaining battery state information sent by the battery system; the second communication module is used for being in wireless connection with a remote system, the second communication module is used for conducting fault diagnosis operation according to the battery state information and obtaining a fault diagnosis result, the second communication module is used for sending the fault diagnosis result to the remote system, and the remote system generates a control instruction according to the fault diagnosis result; wherein the second communication module is further used for receiving the control instruction and processing the control instruction; and the first communication module is also used for sending the processed control instruction to the battery system. According to the embodiment of the invention, the battery state information is acquired at the local side, and the fault diagnosis result is calculated at the local side, so that the accuracy and timeliness of fault diagnosis are improved.

Description

technical field [0001] The present invention relates to the technical field of fault diagnosis, and in particular, to a fault diagnosis chip, method, system and storage medium. Background technique [0002] At present, in the field of battery safety technology, an early warning mechanism is set on the remote platform side to provide early warning of battery safety failures. [0003] However, in the above method, since the early warning mechanism is set on the remote platform side, the accuracy and timeliness of fault diagnosis will be affected. SUMMARY OF THE INVENTION [0004] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention provides a fault diagnosis chip, method, system and storage medium, which can improve the accuracy and timeliness of fault diagnosis. [0005] The fault diagnosis chip according to the embodiment of the first aspect of the present invention includes: [0006] a fi...

Claims

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Application Information

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IPC IPC(8): G01R31/371G01R31/36
CPCG01R31/371G01R31/36
Inventor 韦绍远姜久春高洋姜研吴智强
Owner 深圳锂安技术有限公司
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