Wafer position pre-alignment method, electronic equipment and wafer transmission system
A transmission system and pre-alignment technology, applied to circuits, electrical components, image analysis, etc., can solve problems such as the complexity of the wafer pre-alignment process
Pending Publication Date: 2022-06-24
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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[0004] In view of this, the purpose of this application is to provide a wafer position pre-alignment method, electronic equipment and wafer transfer system, which solves the problem of relatively complicated wafer pre-alignment process
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[0035] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only It is a part of the embodiments of the present application, but not all of the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations. Thus, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application as claimed, but is merely representative of selected embodiments of the application. Based on the embodiments of the present application, every other embodiment obtaine...
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The invention provides a wafer position pre-alignment method, electronic equipment and a wafer transmission system, and the method comprises the steps: obtaining a first target image of a first mark of a to-be-aligned wafer, and determining the current position of the first mark; determining an expected current position of the second mark based on the current position of the first mark and a position relationship between the first mark and the second mark; controlling the wafer bearing platform to move based on the expected current position of the second mark, acquiring a second target image of the second mark of the to-be-aligned wafer, and determining the current position of the second mark; based on the current position of the first mark and the current position of the second mark, the centroid position and the wafer centroid offset of the wafer to be aligned are determined; and controlling the wafer bearing platform to move according to the wafer center offset, and moving the centroid position of the wafer to be aligned to the target position. By adopting the wafer position pre-alignment method, the electronic equipment and the wafer transmission system, the problem that the existing wafer position pre-alignment process is relatively complicated is solved.
Description
technical field [0001] The present application relates to the field of semiconductor technology, and in particular, to a wafer position pre-alignment method, an electronic device, and a wafer transfer system. Background technique [0002] With the continuous development of semiconductor technology, the process of wafer processing is becoming more and more complex, and the requirements for the transmission accuracy of wafers during wafer processing are also getting higher and higher. Completed, the wafer needs to be pre-aligned before the transfer is completed, so that its aligned position meets the accuracy requirements. [0003] At present, the wafer pre-alignment scheme is: place the wafer on the pre-alignment stage of the wafer transfer system, and use line scan cameras and area scan cameras to position and align the wafers. This scheme not only requires setting The pre-alignment stage with complex mechanical and electrical mechanisms, and the use of line scan cameras an...
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IPC IPC(8): H01L21/68G06T7/66G06T7/20
CPCH01L21/68G06T7/66G06T7/20G06T2207/30148
Inventor 王家林罗杨牛岩
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC