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LED chip sorting method

A technology for LED chips and sorting, applied in sorting and other directions, can solve problems such as low LED chip sorting efficiency, and achieve the effects of being conducive to mass production implementation, solving low efficiency and simple operation

Pending Publication Date: 2022-06-28
JIANGXI ZHAO CHI SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, the purpose of the present invention is to provide a LED chip sorting method to fundamentally solve the problem of low efficiency of the existing LED chip sorting

Method used

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Embodiment 1

[0043] see figure 1 , shows the LED chip sorting method in the first embodiment of the present invention, and the method specifically includes steps S01 to S02.

[0044] Step S01 , the LED chips in the concentrated area where the same BIN is concentratedly distributed on each LED wafer are orderly arranged on the corresponding empty blue film in a reverse mold manner until the empty blue film is completely drained.

[0045] Wherein, in the embodiment of the present invention, the LED chip sorting method is applied after the LED chip testing process, and is used for sorting the tested LED chips according to a corresponding manner. Specifically, in the LED chip testing process, firstly, a dicing machine or a cutting machine is used to dicing and cutting the LED wafer to form multiple independent LED chips, and at the same time, the backside of the LED wafer that is cut to form multiple LED chips is pasted. The blue film is adhered. At this time, two probes in each group of prob...

Embodiment 2

[0053] see figure 2 , shows the LED chip sorting method in the second embodiment of the present invention, and the method specifically includes steps S11 to S13 .

[0054] Step S11, sorting out each LED chip with bad photoelectric parameter data determined by the photoelectric characteristic test on each LED wafer and each LED chip with bad appearance determined by the appearance test.

[0055] In the embodiment of the present invention, referring to the foregoing method embodiment, before sorting the LED chips, the LED chips need to be tested for optoelectronic characteristics and appearance. At this time, the tested LED chips with poor optoelectronic parameter data and The LED chips with poor appearance are marked, which is specifically marking the coordinate position of the LED chip and marking the BIN value as the secondary BIN. The specific photoelectric parameter data is bad because the tested photoelectric parameter data exceeds the reasonable range of photoelectric pa...

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Abstract

The invention provides an LED (light-emitting diode) chip sorting method, which comprises the following steps of: orderly arranging each LED chip in a concentrated area in which the same BIN is intensively distributed on each LED wafer on a corresponding empty blue film in a reverse mold manner until the empty blue film is fully arranged; and sorting the LED chips in other areas, where the same BINs are scattered and distributed, on the LED wafers to the corresponding new empty blue films one by one according to the coordinates corresponding to the BINs until the corresponding new empty blue films are fully arranged. According to the invention, a large number of LED chips which are distributed in a concentrated manner and have the same BIN are transferred to the empty blue film in a film reversing manner and are arranged in order, and then other LED chips which are distributed in a small number and not distributed in a concentrated manner are sorted one by one by using the sorting equipment, so that the productivity of most existing sorting equipment can be replaced by using the film reversing manner; the problem that existing LED chip sorting efficiency is low is solved.

Description

technical field [0001] The invention relates to the technical field of chip sorting, in particular to a method for sorting LED chips. Background technique [0002] In the process of producing LED chips, process control errors are inevitably generated, which will lead to certain differences in the luminous efficiency and dominant wavelength of the LED chips at different positions on the LED wafer. In the LED chip industry, binning is performed according to the dominant wavelength and optical power of the emitted light. Usually, LED chips with the same optical or electrical parameters are grouped together, which is called binning. [0003] At present, there are two ways to ship the LED market: square wafers and round wafers. Among them, square wafers are shipped according to customers' requirements for optoelectronic specifications of products. Therefore, it is necessary to carry out the above-mentioned steps for good LED chips in multiple wafers. Sub-BIN realizes sub-classif...

Claims

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Application Information

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IPC IPC(8): B07C5/02B07C5/344B07C5/36B07C5/38
CPCB07C5/02B07C5/344B07C5/36B07C5/38B07C2301/0008
Inventor 李美玲张星星简宏安胡加辉金从龙
Owner JIANGXI ZHAO CHI SEMICON CO LTD
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