Flexible device packaging structure and packaging method

Abstract

A flexible device packaging structure comprises a flexible circuit board and a component arranged on the flexible circuit board, and a gold wire connected with the component and the flexible circuit board is formed between the component and the flexible circuit board. A first packaging layer is arranged on the surface of the component, a second packaging layer is arranged between the first packaging layer and the flexible circuit board, and a third packaging layer is wrapped outside the flexible circuit board; the first packaging layer wraps the component and the gold wire; the second packaging layer is made of a transparent material, and the second packaging layer is formed on the surface of the first packaging layer; the third packaging layer is of a black structure, and when the third packaging layer wraps the flexible circuit board, the top of the component does not make contact with the third packaging layer; compared with the prior art, the black third packaging layer is used on the outer layer in the flexible period, and the upper flexible lining body and the lower flexible lining body are formed by injecting materials into the third packaging layer twice, so that the light loss in the using process is ensured, and the flexible circuit is protected during stretching and bending, and is prevented from being excessively deformed.

Description

technical field [0001] The invention relates to the technical field of flexible electronics, in particular to a packaging structure and a packaging method of a flexible device. Background technique [0002] As electronic systems have become lighter and smaller, the semiconductor packages used in electronic systems have continued to shrink in size. With the increased interest in portable and wearable electronic systems, there has been an increasing focus on flexible electronic devices, which are devices that remain flexible in the presence of a range of deformations (bending, folding, torsion, compression, or tension). Working electronic equipment. [0003] However, the corresponding technical requirements also restrict the development of flexible electronics. The main technical problems it faces include: the package size is large, and it is difficult to meet the stretchability and bendability; the structure is complex, which leads to an overly complicated packaging process...

AI Technical Summary

Problems solved by technology

[0003] However, the corresponding technical requirements also restrict the development of flexible electronics.

The main technical problems it faces include: large package size, difficult to meet the stretchability and bending; complex structure, resulting in too complicated packaging process

[0006] In the packaging method disclosed above, the flexible chip and the flexible circuit board are always connected through the setting of the lead wires, but when the skin contacts the flexible device, the flexible device will be deformed to a certain extent, thereby affecting the use of the flexible device

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