Anode assembly, electroplating device and manufacturing method of anode assembly

Abstract

The invention discloses an anode assembly, an electroplating device and a manufacturing method of the anode assembly. Wherein the anode assembly comprises an insoluble anode net and an insulating blocking piece; the insoluble anode net comprises a front surface, and the front surface is used for facing a to-be-plated part; at least a portion of the insulating barrier is disposed on the front surface of the insoluble anode mesh. According to the arrangement, at least one part of the front face of the insoluble anode net is shielded through the insulation blocking piece, the electric field intensity of the corresponding position is weakened, and therefore the corresponding position of the to-be-plated piece cannot obtain excessive metal, and the thickness of the corresponding position of the to-be-plated piece can be controlled to a certain degree; and electroplating uniformity can be realized, and the reliability of the semiconductor packaging structure can be ensured.

Description

technical field [0001] The present application relates to the field of electroplating and packaging, and in particular, to an anode assembly, an electroplating device and a method for manufacturing the anode assembly. Background technique [0002] In the semiconductor packaging process, an electroplating process needs to be used to form a redistribution layer on the to-be-packaged die cut from the wafer, so as to lead out the solder joints on the to-be-packaged die to form pins. However, the current electroplating process cannot achieve electroplating uniformity. In other words, when the redistribution layer is formed on the to-be-packaged die, the surface of the re-distribution layer away from the to-be-packaged die cannot form a flat surface. Due to the limitation of the process, the redistribution layer directly connected to the solder joints of the die to be packaged cannot be ground, and the uneven surface of the redistribution layer will affect the formation of the sub...

AI Technical Summary

Problems solved by technology

However, the current electroplating process cannot achieve electroplating uniformity. In other words, when the rewiring layer is formed on the die to be packaged, the surface of the rewiring layer far away from the die to be packaged cannot form a flat surface.

Due to the limitations of the process, it is impossible to grind the rewiring layer directly connected to the solder joints of the die to be packaged, and the uneven surface of the rewiring layer will affect the formation of subsequent hierarchical structures, and ultimately affect the reliability of the semiconductor packaging structure

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