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Process chamber and semiconductor process equipment

A process chamber and semiconductor technology, applied in semiconductor/solid-state device manufacturing, discharge tubes, electrical components, etc., can solve the problem that the wafer etching rate and selection ratio cannot be adjusted independently

Pending Publication Date: 2022-07-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention discloses a process chamber and semiconductor process equipment to solve the problem that the wafer etching rate and selection ratio cannot be independently adjusted during the semiconductor manufacturing process

Method used

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  • Process chamber and semiconductor process equipment
  • Process chamber and semiconductor process equipment
  • Process chamber and semiconductor process equipment

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Embodiment Construction

[0020] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Combine the following Figure 1 to Figure 9 , the technical solutions disclosed in the various embodiments of the present invention are described in detail.

[0022] refer to Figure 1 to Figure 4 , a process chamber disclosed in an embodiment of the present invention includes a cavity 100 and a lining 200 , a lower electrode device 300 , an adjustable inducta...

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Abstract

The invention discloses a process chamber and semiconductor process equipment, and relates to the technical field of semiconductor manufacturing. The process chamber comprises a grounded cavity, and a lining, a lower electrode device, an adjustable inductance device and a capacitance adjusting piece which are arranged in the cavity, the lining is arranged on the outer side of the lower electrode device in a surrounding mode, a gap is formed between the lining and the inner wall of the cavity, and the capacitance adjusting piece is arranged in the gap in a lifting mode and used for adjusting the ground capacitance value of the lining; and one end of the adjustable inductance device is connected with the lining, and the other end is grounded for adjusting the ground inductance value of the lining. According to the scheme, the problem that the wafer etching rate and the selection ratio cannot be independently adjusted in the semiconductor manufacturing process can be solved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a process chamber and semiconductor process equipment. Background technique [0002] With the upgrading of integrated circuit technology, the requirements for semiconductor process equipment are getting higher and higher. During the semiconductor etching process, the etching rate of the conductor process equipment is affected by many factors such as airflow field, temperature field, geomagnetic field, coil magnetic field, and electric field. Moreover, in the related art, it is difficult to take into account the wafer etching rate and the selection ratio in the process of adjusting the wafer etching rate in the semiconductor process equipment used in the semiconductor manufacturing process. SUMMARY OF THE INVENTION [0003] The invention discloses a process chamber and semiconductor process equipment to solve the problem that the wafer etching rate a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H01L21/67
CPCH01J37/32798H01L21/67069H01L21/67213H01J2237/334
Inventor 左杰
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD