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Heat dissipation assembly, heat dissipation method and heat dissipation device

A heat-dissipating component and technology to be dissipated, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problem of poor heat-dissipation capability of heat-dissipating components, achieve precise adjustment, improve heat-dissipation capability, and simple adjustment method

Pending Publication Date: 2022-07-01
SHANGHAI SIGRINER STEP ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, there is currently a problem of poor heat dissipation of heat dissipation components

Method used

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  • Heat dissipation assembly, heat dissipation method and heat dissipation device
  • Heat dissipation assembly, heat dissipation method and heat dissipation device
  • Heat dissipation assembly, heat dissipation method and heat dissipation device

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Embodiment Construction

[0023] It can be known from the background art that the current heat dissipation components have the problem of poor heat dissipation capability.

[0024] The analysis found that one of the reasons for the poor heat dissipation capacity of the current heat dissipation components is that at present, with the large-scale application of device integration, the area of ​​the device is getting smaller and smaller. The heat is taken away, and the wind speed of the fan needs to be increased. However, the increase in the wind speed of the fan means the corresponding increase in the speed and noise of the fan. In order to meet the cooling requirements and improve the noise of the fan, the speed of the fan needs to be adjusted according to different device temperatures, so that the device temperature When lower, the fan can reduce the speed, thereby reducing the noise. However, the current fan usually uses a frequency converter to adjust the speed of the fan, and the board circuit of t...

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Abstract

The embodiment of the invention relates to the technical field of heat dissipation, in particular to a heat dissipation assembly, a heat dissipation method and a heat dissipation device.The heat dissipation assembly comprises a radiator, the radiator is provided with a heat conduction face, the heat conduction face is further provided with a device containing area, and the device containing area is used for containing a device to be subjected to heat dissipation; the heat-sensitive element is electrically connected with the control circuit, the control circuit is used for adjusting the rotating speed of the fan based on the change of an electric signal of the heat-sensitive element, the heat-sensitive element is fixed to the area, except the device placing area, of the heat conduction face, and the electric signal of the heat-sensitive element corresponds to the temperature of the heat conduction face. According to the embodiment of the invention, the heat dissipation capability of the heat dissipation assembly is improved.

Description

technical field [0001] Embodiments of the present application relate to the field of heat dissipation technologies, and in particular, to a heat dissipation component, a heat dissipation method, and a heat dissipation device. Background technique [0002] Usually, the heat dissipation component includes a radiator and a fan, and the fan is the core component of a traditional air-cooled heat dissipation product. Among them, the heat sink is used to dissipate the heat of the device, and the fan uses the wind speed to increase the heat dissipation speed on the surface of the heat sink, thereby improving the heat dissipation effect. With the large-scale application of device integration, the area of ​​the device is getting smaller and smaller, so a fan is required to take away the heat of the device in a smaller space. [0003] However, there is a problem that the heat dissipation capability of the heat dissipation component is not good at present. SUMMARY OF THE INVENTION ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20209H05K7/2039
Inventor 张浏骏段杰芳邓铁男
Owner SHANGHAI SIGRINER STEP ELECTRIC
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