Double-sided conductive laminated structure and manufacturing method thereof

Abstract

The invention discloses a double-sided conductive laminated structure and a manufacturing method thereof. The double-sided conductive laminated structure comprises a base material, a first conductive layer and a second conductive layer, the substrate has an upper surface and a lower surface opposite to the upper surface, and at least one through hole is formed between the upper surface and the lower surface. The first conductive layer covers the upper surface, the lower surface and the hole wall of the at least one through hole. And the second conducting layer covers the first conducting layer on the upper surface of the base material, and simultaneously, the second conducting layer also covers the first conducting layer on the lower surface of the base material, so that the upper surface and the lower surface of the base material are electrically conducted. Through the technical scheme disclosed by the invention, the existing process steps and process cost can be effectively saved, good cleanliness can be maintained during drilling, and meanwhile, the problem that the known chemical plating process has variability is avoided.

Description

technical field [0001] The present invention relates to a conductive structure of a transparent display device, in particular to a double-sided conductive laminate structure and a manufacturing method thereof, which has a double-sided conductive layer and can save the existing process steps and process costs. Background technique [0002] According to press, the high-density design of the circuit board from its origin to the present is usually directly and closely related to silk screen printing or screen printing, so it is called a printed circuit board. At present, in addition to the largest number of applications in circuit boards, other electronic industries have thick film (Hybrid circuit), chip resistance (Chip resist), and surface mount (Surface mounting) solder paste printing etc. also have their applications. Generally speaking, the function of a printed circuit board (PCB) is to provide a base where the components that complete the first-level assembly are joined ...

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Problems solved by technology

[0007] Moreover, another object of the present invention is also to use this kind of double-sided conductive laminated structure, which only contains a single material substrate before the drilling process, so when the subsequent electroless plating process is performed, due to The electroless plating process is directly electroless plated on a single material substrate, so there is no difference in the conductor or layer structure described in the prior art, which naturally solves the problem of uneven process or selective electroless plating thickness described in the prior art. question

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