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Method and system for printing solder on wafer

A chip and solder technology, applied in the field of printing solder on the chip and its system, can solve the problems of insufficient solder amount, long time, high cost of template manufacturing and use, etc.

Pending Publication Date: 2022-07-08
INARI TECH SDN BHD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Stencils are expensive and complex to manufacture and use since the vertical depth of the vias is much greater than the low height of the pads printed on the wafer surface
Using stencils during wafer-level solder patterning is also time-consuming because it takes longer to fill vias with solder than to print thin pads on the wafer surface
Attempts to speed up the process can leave inaccurately positioned solder patterns, or vias with insufficient solder

Method used

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  • Method and system for printing solder on wafer
  • Method and system for printing solder on wafer
  • Method and system for printing solder on wafer

Examples

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Embodiment Construction

[0026] Hereinafter, the present invention shall be described in accordance with preferred embodiments thereof and by referring to the specification and drawings. It should be understood, however, that the description is limited to the preferred embodiments of the invention only to facilitate discussion of the invention, and it is contemplated that various modifications may be devised by those skilled in the art without departing from the scope of the appended claims.

[0027] The invention will now be described in more detail by way of example with reference to the accompanying drawings.

[0028] figure 1 A block diagram of a system for printing solder onto a wafer 101 is shown, the system including a wafer solder printer 1 configured to deposit solder paste 102 onto the wafer. Solder paste 102 is a mixture of tiny solder balls held within a special form of flux that has the texture of the solder paste. The purpose of the printer 1 is to deposit exactly the correct amount on...

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Abstract

A method of printing solder onto a wafer (101) includes the steps of depositing a solder paste (102) onto the wafer (101), applying an online reflow process to the deposited solder paste (102) to form solder bumps (103) on the wafer (101), and cleaning the reflow solder bumps (103). A method of printing solder onto a wafer (101) is based on a system thereof comprising a wafer solder printer (1), an online reflow device (2) and a desoldering device (3), where each step has parameters optimized by segmented process control.

Description

[0001] Field of Invention [0002] The present invention relates to a method for printing solder onto a wafer, in particular with optimized parameters in the segmented process control employed to achieve appreciable yields within a predetermined time. [0003] Background of the Invention [0004] Currently, in the wafer-level circuit and component assembly industry, solder printing techniques utilize a stencil to print solder paste on the top surface of the wafer or fill vias on the wafer with solder. Since the vertical depth of the vias is much greater than the low height of the pads printed on the wafer surface, the stencils are expensive and complex to manufacture and use. Using stencils during wafer-level solder patterning is also time-consuming because filling vias with solder takes longer than printing thin pads on the wafer surface. Attempting to speed up the process can leave a poorly positioned solder pattern, or vias with insufficient solder. [0005] A number of te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F15/08B41F15/14B41F35/00B41M1/12H01L21/48
CPCB41F15/08B41F15/14B41F35/00B41M1/12H01L21/4814B41P2215/10B41P2215/50B41P2235/00H01L24/11H01L2224/11849H01L2224/1132H01L24/13H01L2224/1181H01L2224/94H01L2224/11332H01L2224/131H01L2224/133H01L2224/11H01L2924/014H01L2924/00014H01L24/81H01L24/75H01L2224/81815H01L2224/81911H01L2224/81908H01L2224/75161H01L2224/759H01L2224/7525H01L24/742H01L2224/117
Inventor 张文成
Owner INARI TECH SDN BHD