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Permanent wafer handler with through silicon vias for thermalization and qubit modification

A qubit and processor technology, which is applied in the manufacture/processing of quantum computers, superconductor devices, instruments, etc., can solve the problems of damage to the final structure, damage, etc., and achieve the effect of easy implementation

Active Publication Date: 2022-07-12
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these conventional packaging methods require removal (ie, debonding) of the flat substrate handler in the final structure
However, removing the substrate handler in the final can create problems in the final structure, including damage to the final structure, such as damage to the substrate with the qubits, the qubits themselves, and / or the interposer and / or other components during removal

Method used

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  • Permanent wafer handler with through silicon vias for thermalization and qubit modification
  • Permanent wafer handler with through silicon vias for thermalization and qubit modification
  • Permanent wafer handler with through silicon vias for thermalization and qubit modification

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Embodiment Construction

[0032] figure 1is a schematic cross-sectional view of a quantum mechanical device 100 according to one embodiment of the present invention. The quantum mechanical device 100 includes a qubit chip 102 that includes a plurality of qubits 104 . In one embodiment, the plurality of qubits may be, for example, superconducting qubits such as Transmon qubits, Xmon qubits, Fluxonium qubits, and the like. The term "qubit chip" is used broadly herein to refer to a substrate that includes two or more qubits.

[0033] The quantum mechanical device 100 also includes an interposer 106 attached to and electrically connected to the qubit chip 102 . In one embodiment, the interposer 106 is attached and electrically connected to the qubit chip 102 using solder bumps 108 .

[0034] In one embodiment, quantum mechanical device 100 further includes superconducting material 110 . In one embodiment, the qubit chip 102 has a plurality of vias 102A, and the interposer has a plurality of vias 106A. ...

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Abstract

A quantum device includes a qubit chip having a plurality of qubits and an interposer attached to and electrically connected to the qubit chip. The apparatus also includes a substrate handler attached to one side of the qubit chip or one side of the interposer or both so as to be in thermal contact with the qubit chip or interposer or both. The substrate handler includes a plurality of through-vias, at least a portion of the plurality of through-vias being filled with a non-superconducting material selected to dissipate heat generated in the qubit chip, the interposer, or both.

Description

Background technique [0001] Presently claimed embodiments of the present invention relate to superconducting quantum mechanical devices and, more particularly, to quantum mechanical devices with permanent substrate handlers and methods of making the same. [0002] Quantum computing is based on the reliable control of quantum bits (referred to throughout this document as qubits). The basic operations required to implement a quantum algorithm are a set of single-qubit operations and two-qubit operations that establish the correlation between two individual qubits. In order to reach the error threshold of quantum computing and to achieve reliable quantum simulation, the realization of high-fidelity two-qubit operations may be desirable. [0003] A superconducting quantum processor (with one or more superconducting qubits) is included on an insulating substrate (eg, Si or high resistivity Si, Al 2 O 3 etc.) on superconducting metals (eg, Al, Nb, etc.). Superconducting quantum ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768H01L23/367H01L23/373H01L23/48H01L23/498H10N60/82H10N60/01H10N60/81H10N69/00
CPCG06N10/00H01L23/3677H01L23/3736H01L23/49827H01L23/481H01L21/76898H01L23/49888H01L23/13H01L23/4006H10N69/00H10N60/82H10N60/01H10N60/81
Inventor 罗载雄洪立玟E·莱文多沃斯基A·纳拉斯贡德
Owner IBM CORP