PCB cleaning equipment
A PCB board and cleaning equipment technology, which is applied in the fields of printed circuit, electrical components, printed circuit manufacturing, etc., can solve the problems of poor effect, drilling dust and copper scraps are easy to adhere to the hole wall, etc., and achieve the effect of improving the effect
Pending Publication Date: 2022-07-19
CHONGQING FOUNDER HI TECH ELECTRONICS +1
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Problems solved by technology
[0004] However, as the density of PCB boards is getting higher and higher, and the application of high-layer PCB boards is becoming more and more extensive, the effect of removing drilling dust and copper filings by high-pressure water washing is not good. Dust and copper shavings are easy to adhere to the hole wall after contact with water
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[0022] In order to make the purposes, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0023] The terms "first", "second" and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It is to be understood that data so used may be interchanged under appropriate circumstanc...
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The embodiment of the invention provides PCB cleaning equipment. The PCB cleaning equipment comprises a wind pressure dust removal assembly and a PCB conveying assembly. Wherein the air pressure dust removal assembly comprises an air knife, a high-pressure air conveying pipeline, a dust hopper and a negative pressure air suction pipeline, the high-pressure air conveying pipeline is connected with the air knife, and the negative pressure air suction pipeline is connected with the dust hopper; the air outlet surface of the air knife faces the opening of the dust hopper; a gap is formed between the air outlet surface of the air knife and the opening of the dust hopper; the PCB conveying assembly is used for conveying a to-be-cleaned PCB to a gap between the air outlet face of the air knife and the opening of the dust collecting hopper. In the embodiment of the invention, drilling dust and copper cuttings on the to-be-cleaned PCB are removed through high-pressure airflow, and meanwhile, the dust collecting hopper connected with the negative-pressure air suction pipeline is used for recycling the removed drilling dust and copper cuttings, so that the drilling dust and copper cuttings are not easy to adhere to the wall of a drilling hole, and the cleaning efficiency is improved. Therefore, drilling dust and copper cuttings generated in the machining process of the PCB can be effectively removed, and the removal effect of the drilling dust and the copper cuttings is improved.
Description
technical field [0001] The embodiments of the present application relate to the technical field of circuit board processing, and in particular, to a printed circuit board (Printed Circuit Board, PCB board for short) cleaning device. Background technique [0002] With the continuous development of PCB boards in the direction of high precision, high density and high reliability, the processing technology requirements for PCB boards are also getting higher and higher. [0003] The purpose of drilling a PCB board is to establish the connection between circuit layers and between components and circuits. After the PCB board is drilled, a large amount of drilling dust and copper shavings are usually left in the drill hole of the PCB board. If the dust is not removed cleanly, the connection between the electroplating layer and the inner layer of copper will be poor, and the copper-plating layer will not be well connected. Poor adhesion to the hole wall; if the copper scraps are not...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/00
CPCH05K3/0055H05K2203/08
Inventor 曹磊磊黄云钟徐竟成唐耀李金鸿何为张胜涛程学文葛天航李洁
Owner CHONGQING FOUNDER HI TECH ELECTRONICS