FPC flexible circuit board integrated processing device and use method thereof

Abstract

The invention discloses an FPC flexible circuit board integrated processing device and a use method thereof.The FPC flexible circuit board integrated processing device comprises a processing device body, the processing device body comprises a first processing box body and a second processing box body, the first processing box body is arranged above the second processing box body, and the first processing box body is provided with a first cavity and a second cavity; the second processing box body is provided with a third cavity, a fourth cavity and a fifth cavity, the length of the first processing box body is larger than that of the second processing box body, a chemical gold leaching device and a filtering treatment device are arranged between the first cavity and the third cavity, and the second cavity and the fourth cavity are provided with a plastering mechanism and a waste residue treatment device. A chambering and edging device is arranged in the fifth cavity, a first discharging pipe is arranged between the first cavity and the third cavity, and a first water inlet pipe and a second discharging pipe are arranged on the side wall of the second cavity. The chemical gold leaching device has the beneficial effects that the structure is compact, the working intensity of workers is relieved, the chemical gold leaching efficiency is improved, and the flatness of the flexible circuit board is improved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to an integrated processing device for FPC flexible circuit boards and a method for using the same. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit, FPC), also known as flexible circuit board, flexible circuit board, is favored for its excellent characteristics such as light weight, thin thickness, free bending and folding... However, the domestic quality inspection cost of FPC high and inefficient. With the rapid development of the electronics industry, the design of circuit boards is becoming more and more high-precision and high-density, and the traditional manual detection methods can no longer meet the production needs. FPC defect automatic detection has become an inevitable trend of industrial development. [0003] Immersion gold, also known as gold, means that the copper and gold on the surface of the substrate are chemi...

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Problems solved by technology

[0002]Flexible Printed Circuit (FPC), also known as flexible circuit board, flexible circuit board, which is light in weight, thin in thickness, free to bend and fold, etc. It is favored due to its unique characteristics..., but the quality inspection cost of FPC in China is high and the efficiency is low

With the rapid development of the electronics industry, the design of circuit boards is becoming more and more high-precision and high-density. Traditional manual inspection methods can no longer meet production needs. FPC defect automatic inspection has become an inevitable trend of industrial development.

[0003] Immersion gold, also known as chemical gold, is to chemically react copper and gold on the surface of the substrate by chemical methods, and the other two are integrated. Its advantage is that it can It makes the welding effect stronger and the color is bright and bright. The disadvantage is that it is difficult to produce, because chemical reactions will occur during production, and related gases will be produced. Improper handling will produce toxic gases and cause certain damage to the production environment.

[0004] However, although the existing production method can process the hard section in the flexible circuit board, there are still many defects: 1. The existing chemical gold immersion device mainly A placement bucket is placed inside the groove, and the inside of the groove contains chemical immersion gold materials, and then the required flexible circuit board is placed directly inside the solution. After the gold immersion is completed, it needs to be transferred to the next process. The structure of the chemical immersion gold device is simple, but due to the direct placement, the flexible circuit board cannot be fully and effectively mixed with the internal solution, and at the same time, the chemical immersion gold cannot quickly enter the next process, which seriously affects the flexible circuit. Wiping efficiency of the board

2. After the chemical immersion gold of the existing flexible circuit board is completed, due to the presence of large particles in the chemical immersion gold solution, the flexible circuit board is adsorbed on the flexible circuit board. After 24 hours, it is adsorbed on the flexible circuit board The large particles on the surface cannot be effectively removed, resulting in the waste of the flexible circuit board

3. The existing flexible circuit board needs to further expand the sides and through holes after the surface is plastered and gold-immersed. The existing device generally fixes the circuit board directly on the horizontal plate, and then rotates it through a rotating prop In the process of processing, the processed waste residue cannot be effectively discharged, so that the processed waste residue is once again adsorbed on the flexible circuit board, causing secondary pollution of the flexible circuit board

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