Circuit board and circuit module

A circuit module and circuit board technology, which is applied in the direction of circuits, electrical components, and electric solid devices, can solve the problems of easy cracking and failure of packaged chips, occupying the effective area of ​​packaged chips, etc., to ensure compactness, improve integration, and ensure Effects on Structural Reliability

Pending Publication Date: 2022-07-29
CHANGXIN MEMORY TECH INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, through the above method of assembly, there are problems such as easy cracking and failure of the

Method used

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  • Circuit board and circuit module
  • Circuit board and circuit module
  • Circuit board and circuit module

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Embodiment Construction

[0042] In order to make the purposes, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions in the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments These are some, but not all, embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present disclosure. It should be noted that, the embodiments of the present disclosure and the features of the embodiments may be arbitrarily combined with each other under the condition of no conflict.

[0043] After the chip is packaged to form a packaged chip, the packaged chip is assembled with the circuit board through a process such as SMT, for example, such as figure 1 As s...

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Abstract

The invention provides a circuit board and a circuit module, the circuit board is used for bearing a packaging chip, the circuit board comprises a substrate, the substrate is provided with a chip bearing area corresponding to the packaging chip, and the chip bearing area comprises a first sub-area corresponding to an electric contact area of the packaging chip and a second sub-area located at the periphery of the first sub-area; the supporting structure is located in the second sub-area and arranged on the surface of the substrate. When the packaging chip is assembled on the circuit board, the periphery of the electric contact area of the packaging chip can be supported through the supporting structure, so that the corner position of the packaging chip is prevented from cracking and losing efficacy due to pressure, and the structural reliability of the packaging chip is ensured. As the supporting structure is arranged on the circuit board, the effective area of the packaged chip is not occupied, the compactness of devices in the packaged chip is ensured, the integration level of the packaged chip is improved, static electricity is not accumulated on the packaged chip, the structure on the packaged chip is prevented from being damaged due to static electricity release, and the reliability of the packaged chip is ensured.

Description

technical field [0001] The present disclosure relates to the technical field of electrical devices, and in particular, to a circuit board and a circuit module. Background technique [0002] After the chip is packaged to form a packaged chip, it can be assembled with a circuit board through a process such as SMT (Surface Mounted Technology, surface mount technology), so as to obtain a circuit module capable of performing certain functions. However, in the above-mentioned assembly, there are problems such as easy cracking and failure of the packaged chip, occupying the effective area of ​​the packaged chip, and ESD (Electro-Static discharge). SUMMARY OF THE INVENTION [0003] The following is an overview of the subject matter detailed in this disclosure. This summary is not intended to limit the scope of protection of the claims. [0004] The present disclosure provides a circuit board and a circuit module. [0005] A first aspect of the present disclosure provides a circ...

Claims

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Application Information

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IPC IPC(8): H01L23/488
CPCH01L24/13H01L2224/13022
Inventor 龚昊陈永瑞
Owner CHANGXIN MEMORY TECH INC
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