Baking device for processing and uniformly baking substrate

Abstract

Embodiments of the present disclosure relate to a baking apparatus for disposing and uniformly baking a substrate and a method for disposing and uniformly baking a substrate. The baking apparatus allows the substrate to be heated to a temperature greater than 50 DEG C without a bend of about 1 mm to about 2 mm from an edge of the substrate to a center of the substrate. The baking apparatus uniformly or substantially uniformly heats a substrate to improve substrate quality.

Description

[0001] background technical field [0002] Embodiments of the present disclosure generally relate to baking apparatus and methods for handling and uniformly baking substrates. Background technique [0003] In the manufacture of optical devices, the substrate may be heated to a temperature greater than 50 degrees Celsius (°C), such as from about 50°C to about 300°C. A substrate, such as a glass substrate, may include one or more materials that allow the substrate to bend at temperatures greater than 50°C. The one or more materials may be materials with an index of refraction greater than 1.5. A substrate having an index of refraction greater than 1.5 when heated to a temperature greater than 50°C may have a bowing of about 1 millimeter (mm) to about 2 mm from the edge of the substrate to the center of the substrate. Thus, when disposed on a heated substrate support, such as a vacuum chuck, electrostatic chuck, or other substrate support operable to retain the substrate and...

AI Technical Summary

Problems solved by technology

Thus, when placed on a heated substrate support such as a vacuum chuck, electrostatic chuck, or other substrate support operable to retain and heat a substrate via a heating element disposed therein, the substrate's Edges may not be held on the heated substrate support, resulting in uneven temperatures across the substrate surface

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