High-heat-flux high-temperature-resistant simulated heat source and application thereof

A technology with high heat flux density and high temperature resistance, applied in indirect heat exchangers, greenhouse gas reduction, lighting and heating equipment, etc., can solve the problems of excessive module volume, complex preparation process, low heat flux density, etc., and achieve low thermal conductivity , Improve heat flux density, high temperature resistance

Active Publication Date: 2022-08-02
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
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  • Claims
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Problems solved by technology

However, traditional analog heat sources usually face disadvantages such as complex preparation p

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  • High-heat-flux high-temperature-resistant simulated heat source and application thereof
  • High-heat-flux high-temperature-resistant simulated heat source and application thereof
  • High-heat-flux high-temperature-resistant simulated heat source and application thereof

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Embodiment Construction

[0028] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0029] The embodiment of the present invention provides a simulated heat source with high heat flux density and high temperature resistance, such as Figure 1 to Figure 3 As shown, it includes a thermal conductor 1, an insulating inner layer 7, an insulating outer layer 2 and a heating body 8, wherein:

[0030] The lower surface of the heat conductor 1 is processed with a groove that matches the he...

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Abstract

The invention belongs to the technical field of engineering thermophysics, and particularly discloses a high-heat-flux high-temperature-resistant simulated heat source and application thereof.The high-heat-flux high-temperature-resistant simulated heat source comprises a heat conductor, a heat insulation inner layer, a heat insulation outer layer and a heating body, a groove is machined in the lower surface of the heat conductor, and the heating body is installed in the groove; a thermocouple mounting hole is formed in the upper part of the heat conductor; the heat insulation inner layer is tightly attached to the outer side of the heat conductor and is fixed by a fixing belt from the outer side in a surrounding mode. The heat insulation outer layer tightly wraps the heat insulation inner layer and the heat conductor in a curing forming mode. By tightly combining the working condition characteristics and heat dissipation requirements of the high-heat-flux electronic device, the simulation heat source which is small in size, high in heat flux, high in reliability and easy to operate and maintain is provided for various different electronic device heat dissipation test scenes.

Description

technical field [0001] The invention belongs to the technical field of engineering thermophysics, and more particularly relates to a simulated heat source with high heat flux density and high temperature resistance and its application. Background technique [0002] With the continuous improvement of the performance requirements of electronic devices, electronic devices are developing rapidly in the direction of miniaturization and integration, and the amount of heat generated per unit area, that is, the heat flux density, will increase significantly. At present, high-power electronic devices The heat flux density reaches 300W / cm 2 , the future will even exceed 1000W / cm 2 . High heat flux will bring high temperature to electronic devices, and the failure rate of electronic devices increases exponentially with the increase of temperature. Therefore, effective thermal management of electronic devices is very important. [0003] Common thermal management methods for high-pow...

Claims

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Application Information

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IPC IPC(8): F28D15/06F28D15/02H05K7/20
CPCF28D15/06F28D15/02H05K7/20381Y02E30/30Y02E60/10
Inventor 罗小兵向霖屹余兴建
Owner HUAZHONG UNIV OF SCI & TECH
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