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Multifunctional chip testing device

A chip testing and multi-functional technology, applied in the direction of electronic circuit testing, etc., can solve the problems of single function, difficulty in meeting the requirements of chip testing, and the degree of integration needs to be improved, so as to achieve the effect of improving detection efficiency

Pending Publication Date: 2022-08-02
SHENZHEN KINCOTO ELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The implementation of these chip test technologies is often a single function, and it cannot realize all or most of the multi-working-condition integrated tests. The degree of integration needs to be improved, and it is difficult to meet a wide variety of chip test requirements.

Method used

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Examples

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Embodiment Construction

[0048] Attached to the following Figure 1-6 This application will be described in further detail.

[0049] The embodiment of the present application discloses a multifunctional chip testing device, refer to figure 1 and figure 2 The multifunctional chip testing device includes an upper airway substrate 1 , a lower airway substrate 2 , two sets of self-floating connection modules 3 and a pick-and-place module 4 . The upper airway substrate 1 and the lower airway substrate 2 face each other and are in close contact with each other. The two sets of quick-release connection assemblies 5 are respectively located on both sides of the upper airway substrate 1 away from each other, and the two sets of quick-release connection assemblies 5 face each other. The hook 52 and the mounting seat of the buckle 51 are fixedly connected to the upper airway base plate 1 , and the hook 52 is fixedly connected to the lower airway base plate 2 . A pressure measurement connection block 12 is f...

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PUM

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Abstract

The invention relates to a multifunctional chip testing device which comprises an upper air channel substrate, a lower air channel substrate, at least two sets of self-floating connecting modules and a material taking and placing module. The upper air channel base plate and the lower air channel base plate are connected through a quick-release connecting assembly. The two ends of the self-floating connecting module are connected with the lower air channel base plate and the material taking and placing module correspondingly, the self-floating connecting module is connected with the material taking and placing module through the quick-release connecting assembly, and the self-floating connecting module can make the material taking and placing module deviate and move relative to the lower air channel base plate; the material taking and placing module is matched with the chip placing plate to take and place the detection chip; the upper air channel base plate and the lower air channel base plate are jointly provided with a pressure measurement feedback air channel, and the pressure measurement feedback air channel communicates with the interiors of all the sets of self-floating connecting modules. The upper air channel substrate, the lower air channel substrate, the self-floating connecting modules and the material taking and placing module are jointly provided with a plurality of independent material taking air channels, the multi-working-condition integration degree of the chip testing device can be improved, and the testing requirements of various kinds of chips can be met.

Description

technical field [0001] The present application relates to the technical field of electronic component testing, and in particular, to a multifunctional chip testing device. Background technique [0002] With the continuous development of current electronic chip technology, the testing technology of packaging and testing chips has also become an important technology in the electronic industry to ensure the quality of test production and accelerate the production process. [0003] At first, it was a traditional manual test. The worker placed the chip to be tested on the testing station of the chip placement board. In the automatic development of electronic chip testing technology, manual manual testing technology is gradually replaced by automatic technology. In the automatic chip testing technology, there are still many problems in the designed automatic chip testing equipment. [0004] For some chip testing devices, the mechanism for picking and placing chips; in chip testin...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2851G01R31/2893
Inventor 刘福瑜林辉敬
Owner SHENZHEN KINCOTO ELECTRONICS EQUIP CO LTD
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